Light Emitting Device Segmented Covering Parts Adhesion
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Solution Overview
Problem
Conventional light emitting devices face challenges in ensuring strong adhesion among various components, leading to issues like warpage, distortion, and uneven brightness, which affect the reliability and luminance of the devices.
Innovation Solution
A light emitting device configuration that includes a substrate with wiring parts, a first covering part to expose these wiring parts, a second covering part with higher reflectivity than the first, and a resin component for sealing, which enhances adhesion and reduces warpage by optimizing the layout and materials of these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin is directly applied on the substrate or film to enclose the light emitting element, then the sealing function is achieved, but the adhesion strength between the resin and substrate/electrical elements is insufficient
Solution Approach 1:
The covering part is divided into a first covering part (low reflectivity) and a second covering part (high reflectivity). The first covering part provides good resin adhesion, while the second covering part enhances light extraction. This segmentation allows each layer to optimize its specific function without compromising the other.
Solution Approach 2:
The light emitting device uses a composite structure with different material properties: the first covering part has low reflectivity for good resin adhesion, while the second covering part has high reflectivity for light extraction enhancement. This composite approach combines the advantages of different material characteristics.
2Reliability
If conventional COB or COF configurations are used, then the manufacturing process is simple, but warpage and distortion occur affecting device reliability
Solution Approach 1:
The patent applies different reflectivity characteristics to different regions: the first covering part (surrounding wiring) has low reflectivity for adhesion, while the second covering part (surrounding light emitting elements) has high reflectivity for light extraction. This local differentiation improves device stability without complicating manufacturing.
3Illumination intensity
If a white resist layer is provided on the substrate surface to improve light extracting efficiency, then light extraction is enhanced, but the adhesion of sealing resin to substrate remains insufficient
Solution Approach 1:
The covering structure is segmented into two functional layers: the first covering part maintains good resin adhesion properties, while the second covering part provides enhanced light extraction through high reflectivity. This segmentation resolves the conflict between adhesion and light extraction enhancement.
Solution Approach 2:
The first covering part acts as an intermediary layer between the substrate and the second covering part. It provides a surface with good resin adhesion while supporting the high-reflectivity second covering part that enhances light extraction, thus mediating between adhesion requirements and light extraction enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration improves adhesion among device components, enhances luminance, reduces uneven brightness, and increases the reliability of light emitting devices while maintaining a conventional configuration.
Implementation Method 1
a second covering part that is disposed on the first covering part surrounding the light emitting elements and is formed from a material whose reflectivity is higher than that of the first covering part
Data Source
AI summary
A light emitting device includes: a substrate having a base body and a plurality of wiring parts provided on at least one side of the base body; a first covering part that covers part of the wiring parts; a plurality of light emitting elements that are disposed on the wiring parts exposed from the first covering part; a second covering part that is disposed on the first covering part surrounding the light emitting elements and is formed from a material whose reflectivity is higher than that of the first covering part, and a resin component that seals the substrate and the light emitting elements, and is disposed in contact with the first covering part and the second covering part.