LED Module Fabrication Using Segmented Mask for Precise Solder Paste Dispensing
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Solution Overview
Problem
The complexity of modularizing LEDs with additional structures to improve light extraction efficiency often leads to defects in the fabrication process of LED modules.
Innovation Solution
A method of fabricating an LED module involving a circuit board with a reflective laminate and electrode pads, using a metal mask with a protruding portion and discharge holes to precisely dispense solder paste onto the electrode pads for bonding the LED chip, thereby simplifying the process and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional structures are provided to improve light extraction efficiency, then light extraction efficiency is improved, but process complexity increases and defects occur
Solution Approach 1:
The mask is divided into a body portion and a protruding portion that extends into the recess. This segmentation allows the mask to access electrode pads in the recess area without requiring complex modularization of the entire LED structure, thus maintaining light extraction efficiency while simplifying the fabrication process
Solution Approach 2:
The protruding portion of the mask acts as an intermediary element that bridges the gap between the flat mask body and the recessed electrode pads. This intermediary structure enables precise solder paste dispensing into the recess without requiring complex modularization of the LED chip or substrate, resolving the contradiction between maintaining access to recessed areas and avoiding process complexity
2Reliability
If additional structures are provided to improve light extraction efficiency, then light extraction efficiency is improved, but defects are caused in fabrication
Solution Approach 1:
By segmenting the mask into a body portion and a protruding portion, the invention enables precise positioning of solder paste only where needed (on electrode pads in the recess), avoiding defects from misplaced paste while maintaining the recess structure for light extraction efficiency
Solution Approach 2:
The protruding portion provides localized access to the recessed electrode pads, applying solder paste precisely where required without affecting other areas. This local quality approach ensures high manufacturing precision for the critical bonding area while maintaining the overall structure for light extraction efficiency
3Ease of operation
If a protruding portion is inserted into the recess, then accessibility to electrode pads is improved, but mask complexity increases
Solution Approach 1:
The mask is segmented into a simple body portion and a protruding portion, where the protruding portion is the only complex element needed for accessibility. This minimal segmentation provides the necessary access to recessed electrode pads without requiring complex modularization of the entire mask structure
Solution Approach 2:
The protruding portion is extracted as a separate functional element from the main mask body, providing the necessary accessibility to the recess while keeping the main mask structure simple. This extraction approach minimizes overall mask complexity while achieving the required ease of operation for solder paste dispensing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the precision and efficiency of soldering the LED chip to the electrode pads, reducing the risk of defects and improving light extraction efficiency while maintaining the structural integrity of the LED module.
Implementation Method 1
a reflective laminate providing a chip mounting region
Implementation Method 2
bonding an electrode of an LED chip to the electrode pad using the solder paste
Data Source
AI summary
A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.