Light-emitting device with segmented plating and protective frame
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Solution Overview
Problem
Conventional light-emitting devices face challenges in effectively sealing and protecting the light-emitting elements, leading to issues such as sulfurization of the Ag and Au plating layers, which affects the reliability and light-extractability of the devices.
Innovation Solution
The proposed light-emitting device incorporates a base with a first lead and a second lead, featuring an Ag plating layer covering the element disposal portion and an Au plating layer covering the wire bonding portions, along with a frame body that surrounds the light-emitting element and covers the end portions of the plating layers, enhancing protection and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the Ag plating layer is used to cover the element disposal portion, then light-extractability is improved, but sulfurization of the Ag plating layer occurs affecting reliability
Solution Approach 1:
The plating structure is segmented into distinct functional zones: Ag plating layer for light extraction on the element disposal portion, and Au plating layer for wire bonding on the bonding portions. This segmentation allows each material to perform its optimal function without suffering from its weaknesses.
Solution Approach 2:
Different plating materials are applied to different locations based on local requirements: Ag plating is applied only where light extraction is needed (element disposal portion), while Au plating is applied where wire bonding is performed (bonding portions). This local quality approach ensures each area has the properties it needs.
2Reliability
If the frame body covers the wire bonding portions, then wire breaking is prevented, but the structure becomes more complex
Solution Approach 1:
The frame body merges multiple protective functions into a single structural element: it provides mechanical support for wire bonding, protects the wire bonding portions from damage, and contributes to the overall structural integrity of the device. This combining of functions reduces the need for additional separate protective components.
3Illumination intensity
If the Ag plating layer extends to the outer circumference of the element disposal portion, then light extraction is maximized, but sulfurization risk increases
Solution Approach 1:
The Ag plating layer is extracted from the outer circumference area and confined to the central element disposal portion. This extraction removes the Ag plating from areas where it would be exposed to sulfurization risks, while preserving its light extraction function in the protected central area.
Solution Approach 2:
The frame body is positioned to cover and protect the Ag plating layer before sulfurization can occur. This preliminary protective action prevents harmful sulfurization from affecting the Ag plating, allowing it to maintain its light extraction properties over time.
Data Source
AI summary
A light-emitting device includes: a light-emitting element; a base including a first lead having an element disposal portion and a first wire bonding portion, a second lead having a second wire bonding portion and a fixing member; a frame provided on a upper surface of the base; an Ag plating layer covering an upper surface of the element disposal portion; an Au plating layer covering at least an upper surface of the first wire bonding portion and at least an upper surface of the second wire bonding portion; a first wire; and a second wire. The Ag plating layer is disposed apart inwardly from at least a part of an outer circumference of an end portion of the element disposal portion, and the frame body is provided at a position that the frame body covers the Ag plating layer, the first wire bonding portion, and the second wire bonding portion.