Light Emitting Device Package Segmented Frame Design

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Solution Overview

Problem

Current light emitting device packages face challenges in maximizing light extraction efficiency, improving bonding strength, and reducing discoloration and thermal stress, while maintaining high reflection efficiency and electrical reliability.

Innovation Solution

The design incorporates a light emitting device package with a body having recesses and spacers, conductive protrusions, and a multi-step reflective structure, where the body is disposed between frames with different heights and conductive portions, and a resin is used to enhance bonding and reflection efficiency, preventing tilting and thermal deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the frame area is reduced to increase body area for light reflection, then light extraction efficiency is improved, but bonding strength between electrode and frame may be compromised

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidbonding strength
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The frame is segmented into multiple protrusions (first protrusion, second protrusion, third protrusion, fourth protrusion) that extend into the body. This segmentation allows the frame to maintain sufficient bonding surface area while reducing the overall frame area, thereby preserving bonding strength while improving light extraction efficiency through increased body area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The frame protrusions extend in the vertical dimension into the body rather than only in the horizontal plane. This dimensional transition allows the frame to maintain bonding capability while reducing horizontal footprint, enabling increased body area for light reflection without compromising bonding strength.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the frame area is reduced to increase body area, then reflection area is increased, but discoloration of the frame may increase due to higher stress concentration

Engineering Contradiction:
Improvereflection areaVSAvoidframe discoloration
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The frame is divided into multiple protrusions that distribute mechanical stress and thermal load across separate regions. This stress distribution prevents concentration of stress that would lead to discoloration, while still maintaining sufficient bonding area. The segmented structure allows the body area to expand for improved reflection without causing frame degradation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protrusions are strategically positioned and sized to provide localized bonding regions with appropriate mechanical properties. This local quality optimization ensures that stress is distributed to specific regions designed to handle it, preventing discoloration while maximizing the body area for light reflection.

Inventive Principle:
Principle #3Local quality

3Reliability

If conductive protrusions are added to improve electrical connection, then electrical reliability is improved, but device complexity increases

Engineering Contradiction:
Improveelectrical reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive protrusions are merged with the structural protrusions of the frame. The same physical structures that provide mechanical support and bonding also provide electrical conduction pathways. This merging eliminates the need for separate conductive elements, thereby improving electrical reliability without significantly increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame protrusions serve multiple functions simultaneously: mechanical bonding, structural support, and electrical conduction. This multi-functionality improves electrical reliability through dedicated conductive pathways while avoiding the complexity increase that would result from adding separate conductive components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Object-affected harmful factors

If the body is positioned at different height than conductive protrusions to prevent thermal stress, then thermal stress dispersion is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvethermal stressVSAvoidheight positioning precision
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The body and conductive protrusions are designed with predetermined height differences in the manufacturing stage. This preliminary action establishes the thermal stress mitigation geometry before operation, allowing for standard manufacturing tolerances rather than requiring high-precision positioning during assembly. The height difference is built-in through the design of protrusion lengths and body positioning.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The vertical position (height parameter) of the body relative to conductive protrusions is optimized to create appropriate spacing. By changing this geometric parameter during design, thermal stress is dispersed effectively while maintaining manufacturability within standard tolerance ranges, avoiding excessive precision requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases light extraction efficiency, improves bonding strength, reduces discoloration and thermal stress, and enhances electrical reliability by dispersing thermal stress and preventing re-melting of the bonding portion under external heat.

Implementation Method 1

the body includes first and second reflective portions extending to both side surfaces of the first protrusion toward the first frame, and third and fourth reflective portions extending to both side surfaces of the second protrusion toward the second frame

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS11417804B2Light emitting device package and light source device
Publication Date: 2022.08.16 SUZHOU LEKIN SEMICON CO LTD
  • US11417804B2 patent drawing
  • US11417804B2 patent drawing
  • US11417804B2 patent drawing

AI summary

The light emitting device package disclosed in the embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting devices disposed on the first and second frames. The first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, the first end portion includes a first protrusion protruding toward the second frame, and the second end portion includes a second protrusion protruding toward the first frame. The light emitting device includes first and second bonding portions disposed on the first and second protrusions. The body includes first and second reflective portions extending toward both sides of the first protrusion toward the first frame, and third and fourth reflective portions extending toward both sides of the second protrusion toward the second frame. The light emitting device may overlap the first to fourth reflective portions in a vertical direction.