Light Emitting Device Manufacturing Using Self-Sealing Lead Frames
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Solution Overview
Problem
Conventional light emitting device manufacturing methods using lead frames struggle with high-density mounting of light emitting elements and require complex equipment, making it difficult to achieve low-cost production.
Innovation Solution
A manufacturing method involving a substrate-forming step to create a planar substrate, a frame-forming step to create a closed frame on the substrate, an element-mounting step to place light emitting elements inside the frame, a sealing step using a liquid material as the sealing member, and a dividing step to separate the light emitting devices with the sealing member exposed, eliminating the need for complex mold-based equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a lead frame with multiple element-mounting units and wire connecting units is used for manufacturing light emitting devices, then light emitting elements can be mounted and connected, but it is impossible to realize high-density mounting and requires complicated equipment using a mold
Solution Approach 1:
The patent extracts the sealing function from the complex mold-based sealing process and integrates it directly into the lead frame structure. The lead frame itself serves as the sealing member, eliminating the need for separate mold equipment while enabling high-density mounting of light emitting elements.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: it serves as the structural support, the mounting substrate for light emitting elements, the wire connecting framework, and the sealing member. This multi-functionality eliminates the need for separate sealing molds and complex equipment.
2Reliability
If a mold-based sealing process is used to seal light emitting elements and wires, then sealing can be achieved, but complicated equipment is required making it difficult to reduce cost
Solution Approach 1:
The sealing function is extracted from the complex mold-based process and integrated into the lead frame structure itself. The lead frame serves as the sealing member, eliminating the need for separate sealing molds and reducing manufacturing costs while maintaining sealing quality.
Solution Approach 2:
The lead frame performs self-sealing by its own structural design. The frame's configuration automatically provides sealing for the light emitting elements and wires without requiring external mold-based sealing equipment, thereby reducing manufacturing complexity and cost.
3Ease of operation
If multiple pairs of wire connecting units insulated from each other are used on the lead frame, then wire connection can be achieved, but device complexity increases
Solution Approach 1:
The lead frame is designed as a multi-functional structure that integrates multiple wire connecting units with insulation in a single unified framework. This universal design provides wire connection capability for multiple light emitting elements while maintaining structural simplicity through the integrated frame design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-density mounting of light emitting elements while avoiding the need for complex equipment, thereby reducing production costs and improving manufacturing efficiency.
Implementation Method 1
a liquid resin as the sealing member is injected into the cavity of the mold and is cured
Data Source
AI summary
A manufacturing method of light emitting devices, comprises a substrate-forming step of forming a planar-shaped substrate, a frame-forming step of forming a closed frame on the substrate, an element-mounting step of mounting multiple light emitting elements in an inside of the frame, a sealing step of injecting a liquid material that is to be a sealing member to the inside of the frame so as to seal the multiple light emitting elements, and a dividing step of dividing the multiple light emitting elements together with the substrate and the sealing member so as to obtain multiple light emitting devices with the sealing member exposed from a side surface thereof.