High Power LED Arrays with Shared Electrical Connections
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Solution Overview
Problem
Conventional LED arrays face challenges in achieving high light emission efficiency due to internal reflection and absorption, and complex electrical connections for color-changing applications, which limit their ability to provide desirable illumination characteristics and dynamic spectral tuning.
Innovation Solution
The use of high-power LED arrays with individually controllable LED chips arranged on a common submount, integrated with an ASIC for control, and shared electrical connections, allowing for dynamic spectral tuning and increased density of LED chips with integrated control circuitry for precise color and brightness adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple colored LED chips are arranged in close proximity on a common submount, then color-changing capability is achieved, but electrical connection complexity increases
Solution Approach 1:
Multiple LED chips of different colors are arranged in close proximity on a common submount, merging their functions to achieve color-changing capability. The shared electrical connections and common control infrastructure reduce the overall complexity compared to separate packages.
Solution Approach 2:
The common submount serves multiple functions: mechanical support for all LED chips, electrical connection hub, and control interface. This universal platform handles diverse colored LED chips through standardized mounting and connection methods, reducing system complexity.
2Loss of energy
If LED chips are arranged at high density on the submount, then light emission efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The LED array is segmented into multiple discrete LED chips arranged in a structured pattern on the submount. This segmentation allows for optimized spacing and positioning that maximizes light extraction while maintaining manufacturable precision tolerances through modular arrangement.
Solution Approach 2:
Different regions of the submount are optimized for specific functions: LED chip mounting areas are designed with precise local geometries for optimal light extraction, while edge regions accommodate electrical connections. This local optimization allows high density arrangement without uniformly increasing precision requirements across the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light emission efficiency, enables precise dynamic spectral tuning, and simplifies electrical connections, resulting in high-power LED arrays capable of producing high-quality, color-changing lighting with improved precision and efficiency.
Implementation Method 1
LEDs convert electrical energy to light and generally include one or more active layers of semiconductor material (or an active region) arranged between oppositely doped n-type and p-type layers. When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions.
Implementation Method 2
Light extraction and external quantum efficiency of an LED can be limited by a number of factors, including internal reflection and/or absorption.
Implementation Method 3
Light extraction and external quantum efficiency of an LED can be limited by a number of factors, including internal reflection and/or absorption.
Data Source
AI summary
Light-emitting diode (LED) arrays, and more particularly high power LED arrays and related devices are disclosed. Exemplary lighting devices with arrangements of LED chips and/or lumiphoric materials are capable of dynamically providing different color points and/or light outputs. Devices include individually controllable LED chips arranged on a common submount that may include integrated control circuitry for controlling operation of the LED chips. LED chips may be arranged to form sub-arrays of like-colored LED chips and corresponding electrical connections may include one or more shared electrical contacts. Certain aspects relate to arrangements where electrical connections are provided on opposite faces of submounts from the LED chips such that an increased density of LED chips may be arranged along primary emission faces. Applications for such high-power LED arrays and related devices include various color-changing lighting fixtures with high light output that may benefit from dynamic spectral tuning with improved precision.