LED Shell Layer Structure for Semiconductor Defect Compensation

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Solution Overview

Problem

Existing display devices face issues with semiconductor layer defects that lower emission efficiency in light-emitting elements, such as LEDs.

Innovation Solution

A light-emitting element design incorporating a shell layer made of divalent metal elements like ZnS, ZnSe, MgS, MgSe, ZnMgS, or ZnMgSe on the semiconductor layers, surrounded by an insulating film, to compensate for defects and enhance emission efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If semiconductor layers are used in light-emitting elements, then light emission function is achieved, but defects in semiconductor layers reduce emission efficiency

Engineering Contradiction:
Improveemission efficiencyVSAvoiddefect compensation
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

A shell layer comprising a divalent metal element is introduced as an intermediary between the semiconductor layers and the external environment. This shell layer compensates for defects in the semiconductor layers, preventing non-radiative recombination at defect sites and thereby improving emission efficiency while maintaining the light emission function of the semiconductor structure

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If shell layer with divalent metal element is added, then defect compensation and emission efficiency improve, but device structure becomes more complex

Engineering Contradiction:
Improveemission efficiencyVSAvoidstructure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The shell layer is designed as a thin film structure that envelops the semiconductor layers. This thin film approach provides defect compensation functionality while minimizing the additional structural complexity and maintaining a compact overall device design

Inventive Principle:
Principle #30Flexible shells and thin films

3Loss of energy

If shell layer is formed on semiconductor layers, then emission efficiency improves, but manufacturing process becomes more complex

Engineering Contradiction:
Improveemission efficiencyVSAvoidfabrication process
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The shell layer is formed on the semiconductor layers during the fabrication process, integrating defect compensation into the manufacturing sequence. This preliminary formation of the shell layer ensures defect compensation is built into the structure from the outset, improving emission efficiency while managing manufacturing complexity through process integration

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design effectively compensates for semiconductor layer defects, improving emission efficiency and maintaining performance in display devices.

Implementation Method 1

a light-emitting element including semiconductor layers and a shell layer formed on the outer surfaces of the semiconductor layers and thereby having any defects in the semiconductor layers compensated for

Methodology Applied
Scientific EffectDefect compensation:

Data Source

PatentUS12538619B2Light-emitting element, method of fabricating the light-emitting element, and display device
Publication Date: 2026.01.27 SAMSUNG DISPLAY CO LTD
  • US12538619B2 patent drawing
  • US12538619B2 patent drawing
  • US12538619B2 patent drawing

AI summary

A light-emitting element includes a first semiconductor layer doped to have a first polarity, a second semiconductor layer doped to have a second polarity different from the first polarity, a light-emitting layer disposed between the first and second semiconductor layers, a shell layer formed on side surfaces of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer, the shell layer including a divalent metal element, and an insulating film covering an outer surface of the shell layer and surrounding the side surface of the light-emitting layer.