LED Backlight Top Reflective Shielding Layer Light Distribution
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Solution Overview
Problem
LED devices have low light emitting efficiency and a small light emitting angle, affecting color saturation, brightness, and contrast in display devices, leading to a poor user experience.
Innovation Solution
An LED device with a substrate, chip, encapsulation structure, and a top reflective shielding layer, where the top reflective shielding layer is positioned centrally on the encapsulation structure to redistribute light, increasing the light emitting angle and optimizing light emitting characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an encapsulation structure is used to protect the chip, then the chip is protected from damage, but the light emitting efficiency and light emitting angle are reduced
Solution Approach 1:
The encapsulation structure is divided into two distinct parts: a transparent encapsulation layer that allows light transmission and a reflective shielding layer that redirects light. This segmentation enables each layer to perform its specific function optimally - the transparent layer protects the chip while maintaining light output, and the reflective layer enhances light distribution without compromising chip integrity
Solution Approach 2:
The reflective shielding layer acts as an intermediary between the chip and the external environment. It receives light from the chip, redirects it at wider angles, and distributes it more uniformly. This intermediary layer solves the contradiction by transforming the light path without blocking the light, thereby maintaining efficiency while expanding the emission angle
2Reliability
If an encapsulation structure is used to protect the chip, then the chip is protected from damage, but the light emitting angle is reduced
Solution Approach 1:
The encapsulation structure is divided into two distinct parts: a transparent encapsulation layer that allows light transmission and a reflective shielding layer that redirects light. This segmentation enables each layer to perform its specific function optimally - the transparent layer protects the chip while maintaining light output, and the reflective layer enhances light distribution without compromising chip integrity
Solution Approach 2:
The reflective shielding layer introduces a new dimensional aspect to light emission by redirecting light in multiple directions rather than allowing it to emit in a single forward direction. This dimensional change in light path distribution effectively increases the light emitting angle while the encapsulation layer maintains chip protection
3Illumination intensity
If a top reflective shielding layer is added to expand light emitting angle, then light distribution is improved, but device complexity increases
Solution Approach 1:
The reflective shielding layer is integrated with the transparent encapsulation layer to form a unified encapsulation structure. This merging eliminates the need for separate assembly steps and reduces the overall device complexity while maintaining the dual functionality of protection and light redistribution. The layers work together as a single functional unit
4Illumination intensity
If the top reflective shielding layer covers a large area of the encapsulation structure, then light redistribution is improved, but light transmittance is reduced
Solution Approach 1:
The reflective shielding layer is positioned specifically at the central position of the encapsulation structure's upper surface, covering only the necessary area for effective light redistribution. This localized placement ensures that light is redistributed where needed while leaving other areas transparent for direct light transmission, thus balancing uniformity improvement with energy conservation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively expands the light emitting angle of the LED device, improving color saturation, brightness, and contrast of displayed patterns, enhancing the user experience by optimizing light distribution and uniformity.
Implementation Method 1
the top reflective shielding layer is disposed on the encapsulation structure and located at a central position of an upper surface of the encapsulation structure, and covers a part of the upper surface of the encapsulation structure
Implementation Method 2
a chip can convert electric energy into optical energy to make the LED device luminous
Data Source
AI summary
Provided are a Light Emitting Diode (LED) device and a backlight module. The LED device includes a substrate, a chip, an encapsulation structure and a top reflective shielding layer; the chip is disposed on the substrate; the encapsulation structure covers the substrate and covers the chip; and the top reflective shielding layer is disposed on the encapsulation structure and located at a central position of an upper surface of the encapsulation structure, and covers a part of the upper surface of the encapsulation structure.