LED with Side-Mounted Chips for Compact Backlight Modules
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Solution Overview
Problem
Conventional light emitting diodes for backlight modules have bulkier designs due to the alignment of blue, red, and green light emitting chips, which increases the size and complexity of the diodes, making them less compact and efficient.
Innovation Solution
A light emitting diode design where the red and green light emitting chips are positioned on the side surfaces and the blue light emitting chip is on the bottom surface of the accommodating space within the main body, allowing for a more compact configuration and reduced bulk, utilizing a transparent or semi-transparent potting material with yellow fluorescent powder to produce pure white light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If blue, red, and green light emitting chips are aligned on the bottom surface, then the light emitting diode can be made with an elongate shape for easy assembly, but the bulk of the light emitting diode is increased
Solution Approach 1:
The patent transitions from a two-dimensional arrangement (all chips on bottom surface) to a three-dimensional arrangement (chips on side surfaces and bottom surface). Specifically, red and green light emitting chips are positioned on inner side surfaces of the main body while the blue light emitting chip remains on the bottom surface, utilizing vertical space to reduce horizontal bulk while maintaining assembly simplicity
Solution Approach 2:
The patent embeds light emitting chips within the accommodating space defined by the main body structure. The red and green chips are nested on the inner side surfaces within the accommodating space, and the blue chip is nested on the bottom surface, creating a compact integrated structure that reduces overall bulk
2Illumination intensity
If yellow fluorescent powder is used to convert blue light to white light, then the light emitting diode can produce white light, but the white light beams are not pure
Solution Approach 1:
The patent employs a composite light emission approach combining multiple light emitting chips (red, green, and blue) instead of relying solely on fluorescent conversion. This multi-component system produces whiter and purer light by directly combining spectral components from different chip types, overcoming the limitations of single-fluorescent-material conversion
Solution Approach 2:
The patent assigns different functional roles to different spatial locations: blue light emitting chips on the bottom surface provide a base illumination, while red and green light emitting chips on the side surfaces add spectral components. This localized functional distribution creates a more uniform and pure white light output throughout the emitting structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more compact and efficient light emitting diode that can produce pure white light, enabling a more compact backlight module with improved illumination patterns and increased density of light emitting diodes.
Implementation Method 1
The yellow fluorescent powder 141 is activated by the blue light beams, and thereby emits white light beams
Implementation Method 2
The red light emitting chip, the green light emitting chip and the blue light emitting chip are positioned on the bottom surface and the side surfaces of the accommodating space, respectively
Implementation Method 3
A light emitting diode includes a main body, a red light emitting chip, a green light emitting chip, and a blue light emitting chip
Data Source
AI summary
An exemplary light emitting diode includes a main body, a red light emitting chip, a green light emitting chip, and a blue light emitting chip. The main body includes two inner side surfaces opposite to each other and a inner bottom surface connected with the side surfaces. The side surfaces and the bottom surface cooperatively define an accommodating space. The red light emitting chip, the green light emitting chip and the blue light emitting chip are positioned at the bottom surface and the side surfaces of the accommodating space, respectively.