LED Side Surface Patterning via Interference Fringes
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Solution Overview
Problem
Conventional LED manufacturing methods struggle to effectively roughen the side surfaces of LEDs, limiting the formation of patterned structures and thus hindering the improvement of external quantum efficiency.
Innovation Solution
A method involving the use of interference fringes to create a patterned mask layer on the side of LEDs, with a high reflection layer generating alternating light and dark regions, allowing for the formation of regularly arranged groove and protrusion structures through etching, which enhances light emission and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the exposure beam is vertically incident on the upper surface of the LED, then the exposure process is simple, but the side surface cannot be effectively irradiated and patterned
Solution Approach 1:
The patent introduces a high reflection layer at the bottom of the channel to redirect the vertically incident exposure beam onto the side surface of the light-emitting unit. This dimensional change in light path enables the exposure beam to irradiate the side surface effectively while maintaining the simplicity of vertical incidence exposure process
Solution Approach 2:
The high reflection layer acts as an intermediary element that mediates between the vertically incident exposure beam and the side surface of the light-emitting unit. It reflects and redirects the light to achieve side surface irradiation without requiring complex exposure geometry
2Reliability
If the surface is roughened by conventional exposure and etching processes, then the external quantum efficiency is improved, but the side surface cannot be patterned due to ineffective irradiation
Solution Approach 1:
By using the high reflection layer to redirect light onto the side surface, the patent enables pattern formation on the side surface through interference fringes, achieving precise patterning that enhances light extraction and improves external quantum efficiency
Solution Approach 2:
The patent applies local patterning to the side surface through interference fringe exposure, creating localized groove structures that specifically enhance light extraction efficiency at the side surface while maintaining other structural integrity
3Ease of manufacture
If no patterned structure is formed on the side surface, then the manufacturing process is simple, but the luminous efficiency cannot be maximized
Solution Approach 1:
The high reflection layer enables interference fringe pattern formation on the side surface using vertically incident light, achieving complex patterning through a relatively simple exposure process and maintaining manufacturing simplicity while improving luminous efficiency
Solution Approach 2:
The interference fringe pattern is self-formed through the optical interference of the exposure beam with itself after reflection from the high reflection layer, eliminating the need for complex mask alignment and simplifying the manufacturing process while achieving precise patterning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise patterning on the side surfaces of LEDs, improving luminous efficiency by altering light paths and increasing contact areas, thereby overcoming the limitations of conventional roughening methods.
Implementation Method 1
a high reflection layer is manufactured at the bottom of the channel; an exposure beam is vertically incident to the surface of the high reflection layer to form interference fringes
Implementation Method 2
an exposure beam is vertically incident to the surface of the high reflection layer to form interference fringes of alternating light and dark
Data Source
AI summary
The present application relates to the field of semiconductor, especially the Light-Emitting Diode (LED) and a manufacturing method thereof. In some examples, by etching the channel between adjacent light-emitting units, making the high reflection layer at the bottom of the channel, and producing interference fringes through the high reflection layer, and the side of the LED is exposed by using the interference fringes, thereby forming the structure of the groove and the protrusion on the side of the LED. Further, the width of the bottom of the groove can be larger than the width of the opening, and a silicon dioxide layer can be provided on the surfaces of the protrusion structures, which can further improve the luminous efficiency of the LED.