Wafer-Level LED Packaging with Side-Extended Terminals
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Solution Overview
Problem
The manufacturing process of light emitting diodes (LEDs) is complex and costly due to the packaging process, which complicates the reduction of device size and increases costs, highlighting the need for a wafer-level packaging technique to simplify the process and reduce the size of the final package structure.
Innovation Solution
A light emitting device with a chip-sized lens and terminal portions that extend along the side surfaces of the substrate, along with a method of manufacturing that includes forming a light emitting structure with stacked semiconductor layers, attaching a support substrate, and forming terminal portions to simplify the process and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional packaging process is used for each LED chip, then the LED can be manufactured with proper protection and electrical connection, but the manufacturing process becomes complex and costly, and the device size increases
Solution Approach 1:
The patent merges multiple individual packaging operations into a single wafer-level packaging process. Multiple LED chips are packaged simultaneously on the substrate using a unified packaging structure, eliminating the need for separate packaging steps for each chip. This reduces manufacturing complexity while maintaining proper protection and electrical connections for all chips.
Solution Approach 2:
The packaging structure is designed as a universal solution that can accommodate multiple LED chips with different configurations. The substrate and packaging layers serve multiple functions simultaneously: mechanical support, electrical insulation, light extraction, and protection, making the process adaptable to various LED chip types without requiring separate packaging procedures.
2Reliability
If a traditional packaging process is used for each LED chip, then the LED can be manufactured with proper protection, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple packaging operations into a single wafer-level process, allowing simultaneous packaging of multiple LED chips. This consolidation reduces per-chip manufacturing costs by eliminating repetitive individual packaging steps, while still providing adequate protection through the unified packaging structure.
3Ease of manufacture
If a traditional packaging process is used for each LED chip, then the LED can be manufactured, but the size of the final package structure increases
Solution Approach 1:
The patent transitions from individual chip-level packaging to wafer-level packaging, effectively changing the scale dimension. By packaging multiple chips simultaneously on the substrate before dicing, the final package size for each individual LED is reduced while maintaining manufacturing feasibility through the standardized wafer processing approach.
4Ease of operation
If terminal portions are extended along side surfaces, then mounting is simplified and electrical connection is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The terminal portions are pre-formed during the wafer-level packaging process, extending along the side surfaces before the chips are diced and mounted. This preliminary formation of electrical connections simplifies the subsequent mounting process, as the terminals are already in their final positions and configurations, ready for direct connection without additional wiring steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a reduction in device size and enhances light extraction efficiency while simplifying the manufacturing process and reducing costs by using a chip-sized lens and terminal portions, allowing for easier mounting and improved light orientation.
Implementation Method 1
a lens disposed on the light emitting structure
Implementation Method 2
a light conversion layer disposed between the lens and the light emitting structure and converting a wavelength of light emitted from the light emitting structure
Data Source
AI summary
Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.