Light-Emitting Device Singulation via Layered Cleaving Paths
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices face challenges in easy singulation while minimizing damage to the layered body, particularly in separating and cleaving semiconductor and wavelength conversion layers without causing chipping or reducing manufacturing efficiency.
Innovation Solution
A method involving a layered body with a wavelength conversion layer, a light-transmissive layer, and a semiconductor layer, where the semiconductor layer is separated into portions and the wavelength conversion layer is cleaved along the removed portion, using techniques like reactive ion etching and laser-induced stress to facilitate easy singulation with reduced damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor layer and wavelength conversion layer are singulated together, then manufacturing efficiency is improved, but the layered body suffers damage such as chipping
Solution Approach 1:
The patent divides the singulation process into two separate steps: first separating the semiconductor layer into individual semiconductor portions, then subsequently cleaving the wavelength conversion layer. This segmentation of the singulation process allows each layer to be processed independently, preventing mutual damage that would occur if singulated together as a single unit.
Solution Approach 2:
The semiconductor layer is separated into individual portions before the wavelength conversion layer is cleaved. This preliminary separation creates defined separation regions that guide the subsequent cleavage process, ensuring that the wavelength conversion layer is cleaved along the correct portions without causing chipping or damage to the semiconductor structures.
2Ease of manufacture
If the wavelength conversion layer is cleaved along the semiconductor layer, then easy singulation is achieved, but chipping occurs during the process
Solution Approach 1:
The patent segments the wavelength conversion layer cleavage to occur only along the regions where semiconductor portions have been previously separated. This targeted approach allows the wavelength conversion layer to be cleaved along defined paths without applying stress to intact semiconductor structures, thereby preventing chipping while maintaining ease of singulation.
Solution Approach 2:
By first separating the semiconductor layer into distinct portions, the patent establishes predetermined separation zones. The subsequent cleavage of the wavelength conversion layer follows these pre-established zones, ensuring that cleavage forces are applied only where separation is intended and where no semiconductor structures are present to be damaged.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient singulation of light-emitting devices with reduced damage to the layered body, improving manufacturing efficiency and minimizing chipping risks during the separation and cleavage processes.
Implementation Method 1
using techniques like reactive ion etching
Implementation Method 2
using techniques like reactive ion etching and laser-induced stress
Data Source
AI summary
A method for manufacturing a light-emitting device includes providing a layered body including a wavelength conversion layer, a light-transmissive layer disposed above the wavelength conversion layer, and a semiconductor layer disposed above the light-transmissive layer, separating the semiconductor layer into a plurality of semiconductor portions above the wavelength conversion layer by removing a part of the semiconductor layer; and singulating the layered body into a plurality of light-emitting devices by cleaving the wavelength conversion layer along a portion where the part of the semiconductor layer is removed.