LED Socket Assembly with Thermally Conductive Base Frame
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Solution Overview
Problem
Existing LED lighting systems face issues with thermal management and miniaturization, as the force applied by socket housings can cause LED packages to fracture, and they are too bulky for efficient dimming and control of luminous output.
Innovation Solution
A socket assembly featuring a thermally conductive base frame with compressible spring elements and an isolator PCB that securely holds an LED package to a support structure, providing a predetermined holding force and efficient heat dissipation, while allowing for easy assembly and dimming capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a socket housing applies force to hold the LED package, then the LED package is securely held, but the LED package may fracture due to excessive force
Solution Approach 1:
The socket housing is divided into a base frame and a separate socket body. The base frame provides structural support and mounting, while the socket body contains the LED package and applies controlled holding force through spring elements. This segmentation allows independent optimization of each component's function.
Solution Approach 2:
The holding force is made variable through spring elements that can compress and expand. The spring constant and pre-compression force are designed to provide sufficient holding force while remaining below the fracture threshold of the LED package. This parameter adjustment resolves the contradiction between secure holding and preventing damage.
2Stability of the object's composition
If the socket housing applies sufficient force to prevent vibration, then the LED package is securely held, but the force may be high enough to cause fracture
Solution Approach 1:
Spring elements are pre-compressed to provide a cushioning force that prevents vibration and instability before they become problematic. The springs act as shock absorbers, accommodating thermal expansion and mechanical stress while maintaining stable contact pressure on the LED package without applying excessive force that could cause fracture.
3Volume of moving object
If LED lighting systems are miniaturized, then space requirements are reduced, but thermal management becomes insufficient
Solution Approach 1:
The base frame combines multiple functions: structural support, mounting interface, and thermal management. The frame is made of thermally conductive material and includes heat dissipation elements integrated into its structure. This merging allows efficient thermal management within a compact form factor, resolving the contradiction between miniaturization and thermal performance.
Solution Approach 2:
The base frame acts as an intermediary thermal path between the LED package and the external environment. It provides a dedicated thermal conduction pathway that efficiently transfers heat away from the LED package, enabling effective thermal management in miniaturized systems where direct heat sinking is not feasible.
4Volume of moving object
If existing LED lighting systems are made compact, then space is reduced, but they remain too bulky for efficient dimming and control
Solution Approach 1:
The isolator PCB integrates multiple functions: electrical isolation, power distribution, signal processing for dimming control, and mechanical support for electronic components. This multi-functionality consolidates what would otherwise require separate components, enabling efficient dimming and control operations within a compact socket assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures secure attachment and effective heat dissipation of LED packages, enabling miniaturization and efficient thermal management, while being cost-effective and easy to assemble, thus addressing the limitations of existing LED lighting systems.
Implementation Method 1
a thermally conductive base frame with compressible spring elements and an isolator PCB that securely holds an LED package to a support structure, providing a predetermined holding force and efficient heat dissipation
Implementation Method 2
a thermally conductive base frame with compressible spring elements that securely holds an LED package to a support structure, providing a predetermined holding force
Data Source
AI summary
A socket assembly comprises a base frame formed of a thermally conductive material holding a light emitting diode (LED) package to a support structure, a contact element electrically contacting the LED package, and an isolator PCB. The LED package includes an LED PCB having an LED mounted on the LED PCB. The base frame includes a base mounted to the support structure and mechanically engaging the LED PCB so that the LED package is attached to the support structure with a predetermined holding force. The contact element electrically connects the isolator PCB to the LED PCB. The isolator PCB supplies electrical power to the LED. The isolator PCB has a first surface and a second surface; the second surface is in heat transmitting contact with the base frame and the electronic component is disposed on the first surface of the isolator PCB and electrically connected to the LED.