LED Display Manufacturing Spacer Bonding Gap Control
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Solution Overview
Problem
Conventional LED display devices face issues with insufficient conductivity due to randomly dispersed conductive particles, leading to higher manufacturing costs, undesirable conductivity, and electrical shorts, primarily caused by inappropriate bonding gaps and poor precision in bonding processes.
Innovation Solution
The introduction of a spacer with a controlled height between bonding pads and LED electrodes, ensuring a specific height relationship (H+3.5 μm≥P μm≥H+0.48 μm) to optimize the bonding gap and prevent over-compression of conductive particles, thereby enhancing conductivity and preventing electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive particles are randomly dispersed in conventional conductive paste, then manufacturing process is simple, but conductivity is insufficient requiring greater amount of particles which increases cost
Solution Approach 1:
The spacer is formed in advance on the substrate before bonding the LED, establishing a predetermined bonding gap. This preliminary positioning ensures that conductive particles are compressed to an optimal degree during bonding, achieving sufficient conductivity without requiring excessive particles, thus resolving the contradiction between conductivity and particle quantity.
Solution Approach 2:
The invention changes the parameter of bonding gap size by introducing a spacer with specific height (H+0.48 μm≥P μm≥H+3.5 μm). This parameter control ensures optimal compression of conductive particles, achieving adequate conductivity while minimizing the required amount of conductive particles, thereby resolving the contradiction.
2Reliability
If bonding gap is excessively large, then conductive particles are not over-compressed, but conductivity becomes undesirable
Solution Approach 1:
The invention transforms the bonding gap from an uncontrolled variable to a precisely controlled parameter by introducing a spacer with height within the range of H+0.48 μm to H+3.5 μm. This parameter control ensures the bonding gap is neither too large (which would reduce conductivity) nor too small (which would over-compress particles), thus resolving the contradiction between conductivity and bonding gap size.
Solution Approach 2:
The spacer acts as an intermediary element between the substrate and LED, mediating the bonding gap distance. It ensures the gap is maintained within the optimal range for conductivity without requiring excessive particle compression, resolving the contradiction between adequate conductivity and appropriate bonding gap size.
3Quantity of substance
If bonding gap is excessively small, then fewer conductive particles are needed, but over-compression of particles occurs reducing conductivity
Solution Approach 1:
By controlling the bonding gap parameter through the spacer (H+0.48 μm≥P μm≥H+3.5 μm), the invention prevents excessive compression of conductive particles. This ensures particles maintain optimal conductivity while using a reasonable quantity, resolving the contradiction between particle amount and conductivity.
4Reliability
If bonding precision is poor with excessive shift, then manufacturing process is less demanding, but contact area is insufficient reducing conductivity
Solution Approach 1:
The spacer is formed in advance on the substrate, creating a physical guide for LED placement. This preliminary structure ensures that even with some manufacturing variation, the LED will bond at the correct position with adequate contact area, resolving the contradiction between contact area and manufacturing precision requirements.
Solution Approach 2:
The spacer acts as a cushioning element that compensates for bonding position variations. By providing a predetermined bonding gap and physical reference, it ensures adequate contact area is achieved even when bonding precision is not extremely high, resolving the contradiction between contact area and manufacturing precision.
5Reliability
If conductive paste is applied without spacer control, then manufacturing process is simpler, but electrical shorts occur between bonding pads
Solution Approach 1:
The spacer serves as an intermediary structure that physically separates the bonding pads and controls conductive paste application. It prevents electrical shorts by ensuring proper spacing and positioning, while the added process step of spacer formation is offset by the elimination of short-circuit defects, resolving the contradiction between electrical isolation and process complexity.
Data Source
AI summary
The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P μm; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H μm. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 μm≥P μm≥H+0.48 μM.