LED Lighting Apparatus with Spherical Resin and Reflector
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Solution Overview
Problem
Conventional LED lighting devices face challenges in enhancing brightness due to light obstruction by LED chips and variations in resin covers, which affect the reflectivity and uniformity of light emission.
Innovation Solution
The proposed LED lighting apparatus features an LED substrate with LED chips mounted on its surface, covered by light-transmissive sealing resin members that bulge in the direction of the substrate's main surface, and surrounded by reflecting faces, which are securely positioned to enhance light directionality and brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflector is placed behind LED chips with reflecting faces corresponding to each LED chip, then light reflection efficiency is improved, but the LED chip blocks part of the reflected light, preventing brightness improvement
Solution Approach 1:
The invention transitions from a two-dimensional planar reflector to a three-dimensional spherical reflector. The spherical shape allows light to be reflected from multiple angles and directions, enabling the reflected light to bypass the LED chip and converge in front of the chip, thereby improving both reflection efficiency and brightness simultaneously.
Solution Approach 2:
The spherical reflector is positioned and shaped in advance to pre-determine the light reflection path. The reflector's surface is configured so that light reflected from it naturally converges in front of the LED chip, preventing the chip from blocking the reflected light and ensuring optimal brightness from the outset.
2Reliability
If resin covers are formed by dropping liquid resin material and hardening it, then LED chips are covered and protected, but variations in shape and height occur, preventing brightness improvement
Solution Approach 1:
The invention replaces the conventional planar resin cover with a spherical resin cover that protrudes from the reflector surface. This spherical shape is formed by controlling the resin material to follow the reflector's curvature, ensuring uniform shape and height that optimizes light transmission and brightness while maintaining chip protection.
Solution Approach 2:
The invention changes the geometric parameters of the resin cover from a flat two-dimensional shape to a three-dimensional spherical shape with controlled radius of curvature. This parameter change ensures uniform light transmission properties and consistent brightness across all LED chips, eliminating the variations caused by conventional dropping methods.
3Reliability
If resin material is used to cover LED chips, then chips are protected, but resin spread and improper shaping cause obstruction and prevent brightness improvement
Solution Approach 1:
The invention transforms the resin cover from a flat planar structure to a three-dimensional spherical structure that conforms to the reflector's curvature. This spherical shaping prevents resin spread issues and ensures the resin cover does not obstruct light paths, while maintaining proper protection of the LED chip.
Solution Approach 2:
The invention applies resin material with specific local properties - the resin is formulated and applied to achieve a spherical shape with controlled viscosity and curing characteristics. This local quality control ensures the resin covers the chip properly without spreading excessively, maintaining the optimal spherical form for light transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light directionality and brightness by minimizing light obstruction and ensuring uniform light distribution, while maintaining the structural integrity and reflectivity of the lighting device.
Implementation Method 1
a reflecting face surrounding the sealing resin member
Data Source
AI summary
An LED lighting apparatus includes an LED substrate, a LED chip, a sealing resin member, and a reflecting face. The LED substrate has a main surface. The LED chip is mounted on the main surface of the LED substrate. The sealing resin member is made of a material that transmits light from the LED chip. The sealing resin member covers the LED chip. The sealing resin member has a shape bulging in the direction in which the main surface faces. The reflecting face surrounds the sealing resin member.