LED Spotlight Module Substrate Segmentation Heat Dissipation

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Solution Overview

Problem

LED spotlights face heat dissipation challenges due to densely arranged LED beads, leading to potential damage and reduced lifespan.

Innovation Solution

A light emitting module with a first substrate having LEDs and wires on its upper surface for heat dissipation and a second substrate with wires for electrical connection, reducing the first substrate's area while maintaining effective electrical connections and improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If LED beads are densely arranged on the substrate to reduce spotlight size, then the spotlight becomes more compact, but heat dissipation becomes difficult and LED damage risk increases

Engineering Contradiction:

Improvespotlight sizeVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The substrate is divided into multiple independent mounting areas where LED beads are arranged in a segmented pattern rather than continuous dense arrangement. This segmentation creates thermal zones that facilitate heat dissipation while maintaining compact overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are designed with different properties: central areas have higher LED density for light output, while peripheral areas have lower density and enhanced heat dissipation structures. This local quality variation optimizes both compactness and thermal management.

Inventive Principle:

Principle #3Local quality

2Illumination intensity

If LED beads are densely arranged on the substrate, then light output is enhanced, but heat accumulation increases and reduces LED lifespan

Engineering Contradiction:

Improvelight outputVSAvoidLED lifespan

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

A heat dissipation layer is introduced as an intermediary between the LED beads and the substrate. This intermediary layer efficiently conducts heat away from the LED junctions while allowing the LEDs to maintain their high-density arrangement for optimal light output.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat generated by dense LED arrangement, which is normally harmful, is converted into a beneficial thermal gradient that drives heat flow toward peripheral dissipation paths. The high current density that produces intense light is managed through optimized electrical pathways that minimize resistive heating.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Area of stationary object

If substrate area is reduced for compact design, then spotlight size decreases, but electrical connection complexity increases

Engineering Contradiction:

Improvesubstrate areaVSAvoidelectrical connection complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

Multiple electrical functions (power supply, control signals, heat dissipation pathways) are merged into integrated conductive traces and structures within the substrate. This consolidation reduces the number of separate connection elements needed while maintaining all necessary electrical connections for the compact LED arrangement.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Electrical connections are routed through multiple layers and dimensions of the substrate rather than confined to a single plane. This three-dimensional routing approach allows complex electrical pathways to be implemented within a compact two-dimensional footprint, reducing substrate area requirements without increasing connection complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides good heat dissipation, extended lifespan, and cost-effectiveness for LED spotlights by separating heat dissipation and electrical connections, reducing the substrate area without compromising electrical connectivity.

Implementation Method 1

the LEDs and the first wires are provided on an upper surface of the first substrate, a lower surface is not provided with wires to well dissipate heat from the LEDs

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS11982432B2Light emitting module for spotlight and spotlight

Publication Date: 2024.05.14 ZHONGSHAN DASHAN PHOTOGRAPHIC EQUIP

AI summary

Provided are a light emitting module and a spotlight. The light emitting module has a first substrate having an upper surface and a lower surface; an LED array and multiple first wires disposed on the upper surface of the first substrate. The LED array includes multiple first LEDs emitting light of a first color and multiple second LEDs emitting light of a second color different from the first color. A second substrate is disposed over or peripheral to the first substrate. A plurality of second wires provided on the second substrate. The second wires are respectively electrically connected with the first wires to connect first LEDs in series or in series-parallel and to connect the second LEDs in series or in series-parallel. The second wires are electrically connected with a driving apparatus configured to drive the first LEDs and the second LEDs to emit light through the first wires.