Compact LED Device With Stacked PCBs For High Voltage Integration
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Solution Overview
Problem
Current LED devices are not compact enough to integrate all necessary functionalities while meeting safety standards set by regulatory authorities, necessitating a design that incorporates both high and low voltage circuitry in a small form factor.
Innovation Solution
A compact LED device is designed with two essentially flat printed circuit boards (PCBs), one with high voltage drive circuitry and the other with low voltage electronic circuitry, featuring a three-dimensional layout that allows for high packing density and separation of power, along with a non-galvanic communication interface for bidirectional communication, and supports DALI functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If all functionalities (high voltage drive circuitry, low voltage electronic circuitry, communication interfaces) are integrated into a single LED device, then the device achieves full functionality and versatility, but the device size and complexity increase
Solution Approach 1:
The device is segmented into two separate printed circuit boards: a first PCB carrying high voltage drive circuitry and LEDs, and a second PCB carrying low voltage electronic circuitry and communication interfaces. This segmentation allows each board to be optimized independently for its voltage level requirements while maintaining overall device functionality.
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration where the two PCBs are positioned face-to-face with circuitries extending in opposite directions from a central interface region. This dimensional change enables high packing density while maintaining separation between high and low voltage components.
2Volume of moving object
If high voltage and low voltage circuitries are placed close together to reduce device size, then compactness is achieved, but safety standards and regulatory requirements may be compromised
Solution Approach 1:
The patent applies different spatial quality requirements to different regions: the central interface region allows close proximity for compactness, while the outer regions extend circuitries in opposite directions to maintain safe separation distances. This local differentiation enables both compactness and safety compliance.
Solution Approach 2:
A non-galvanic communication interface acts as an intermediary between the high voltage and low voltage circuitries, enabling signal transmission without direct electrical connection. This eliminates galvanic isolation requirements while maintaining safety, allowing the boards to be positioned closely without compromising safety standards.
3Volume of moving object
If circuitries are arranged in a three-dimensional layout to achieve high packing density, then device thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into independent PCB fabrication steps followed by a simple assembly operation. Each PCB can be manufactured using standard planar fabrication techniques, and the final three-dimensional configuration is achieved through a single assembly step where the PCBs are positioned face-to-face and connected at the interface region.
Data Source
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Figure 4
AI summary
A light emitting diode (LED) device (2) comprising at least one LED (4), and that comprises two printed circuit boards (PCBs), a first PCB (6) and a second PCB (8); the PCBs are essentially planar and have a similar size and shape, and are provided with circuitry on one side. These circuitry sides are configured to face each other when the PCBs are mounted together, and that said second PCB is mounted above said first PCB in a parallel fashion to define said device. The first PCB (6) comprises high voltage circuitry (10), e.g. 230 VAC drive circuitry, and said at least one LED (4), wherein said at least one LED (4) being mounted to generate light in an essentially perpendicular direction in relation to the plane of the first PCB (6). The second PCB (8) comprises various low voltage electronic circuitry (12), e.g. related to signal control and communication, and that said second PCB (8) comprises at least one opening (14) allowing light generated by said at least one LED (4) to pass through said second PCB (8). The circuitries (10, 12) on the PCBs are designed in three dimensions to achieve high packing density, wherein said three dimensional design has resulted in three dimensional formations of the circuitries on the PCBs that are adapted to each other such that, when said PCBs are mounted together, the formations cooperate with each other by allowing high formations on one PCB to interpose with low formations on the other PCB, and that a predetermined minimum distance d between three dimensional formations on different PCBs are obtained. The LED device (2) has a flat and thin extension with a height H in the range of 5-20 mm.