Side-view LED Package Step Projection Resin Lens
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Solution Overview
Problem
Conventional side-view type light emitting diode packages experience reduced light efficiency when the opening portion for the light emitting diode chip is filled with a phosphor-containing light-transmittable resin, as the upper surface of the resin becomes concave, leading to potential damage from external forces.
Innovation Solution
A side-view type light emitting diode package with an opening portion featuring a step projection, which partitions the opening into upper and lower sections, allowing the light-transmittable resin to form a convex lens shape and be positioned below the package body's upper surface, enhancing light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the opening portion is filled with light-transmittable resin containing phosphor, then the package can emit white light, but the upper surface of the resin becomes concave reducing light efficiency and making it vulnerable to external damage
Solution Approach 1:
The invention introduces a step projection that creates a two-level structure in the opening portion, dividing it into a first region (lower level) and a second region (higher level). This dimensional change allows the resin to form a convex lens shape in the first region while the second region provides protection, simultaneously improving light efficiency and reliability.
Solution Approach 2:
The opening portion is segmented into two distinct regions by the step projection: a first region for holding the resin that forms a convex lens shape to improve light emission, and a second region that provides protection. This segmentation allows each region to serve its specific function optimally.
2Illumination intensity
If the amount of light-transmittable resin is increased to improve light efficiency, then more light can be transmitted, but the resin protrudes above the package body surface making it vulnerable to damage
Solution Approach 1:
By creating a step projection that establishes different height levels, the invention allows the resin to extend to a greater amount in the first region (improving light transmission) while the second region remains at a higher level to protect the resin from external damage. This resolves the contradiction by using vertical dimensionality to separate the functions of light transmission and protection.
3Adaptability or versatility
If the opening portion is designed with inclined sidewalls to widen visible angle, then the package is suitable for backlight display, but the resin surface becomes concave reducing light efficiency
Solution Approach 1:
The opening portion is divided into two regions by the step projection. The first region (lower level) has a flat bottom surface that allows the resin to form a convex lens shape for improved light emission efficiency. The second region (higher level) can accommodate the inclined sidewall design for widened visible angle. This segmentation allows both requirements to be satisfied in different spatial zones.
Solution Approach 2:
Different portions of the opening portion are given different geometric characteristics: the first region has a flat bottom surface optimized for light emission efficiency, while the second region can have inclined sidewalls optimized for visible angle. This local differentiation of geometric properties allows each region to optimize for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The convex lens shape of the light-transmittable resin improves light emission efficiency while preventing damage from external forces, compared to conventional concave or flat resin shapes.
Implementation Method 1
a light-transmittable resin covering the light emitting diode chip... The convex lens shape of the light-transmittable resin improves light emission efficiency
Data Source
AI summary
A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.