LED Strip Bulb Layout for Heat Dissipation and Omnidirectional Light
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Solution Overview
Problem
Existing LED lamps face challenges in heat dissipation, leading to high costs and inefficiencies due to the concentration of heat in small areas, which affects their performance and longevity, and they often do not replicate the spherical light distribution of incandescent bulbs, causing issues with shadow lines and flux variations in luminaires.
Innovation Solution
The use of flexible LED strips with low-power bare LED dies, spread over a large surface area, allowing for efficient cooling through ambient air, and arranged in various patterns to mimic the light distribution of incandescent bulbs, along with dynamic feedback systems to manage heat and maintain consistent color temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high power LEDs are used to achieve desired lumen output with fewer LEDs, then the number of LEDs is reduced, but heat dissipation becomes difficult due to concentrated heat in small areas
Solution Approach 1:
The patent divides the LED array into multiple separate LED modules distributed across a larger surface area. Each module contains fewer high-power LEDs, but the modular distribution prevents heat concentration in a single location, enabling better thermal management while maintaining total lumen output.
Solution Approach 2:
The patent transitions from a planar substrate mounting approach to a three-dimensional distributed arrangement of LED modules across the bulb surface. This spatial distribution in multiple dimensions increases the effective heat dissipation surface area and allows ambient air to access heat sources from multiple directions.
2Device complexity
If high power LEDs are mounted on a flat substrate, then the structure is simple, but heat removal is difficult and metal heat sinks add cost and weight
Solution Approach 1:
The patent extracts the heat dissipation function from the mounting substrate by distributing LED modules independently across the bulb surface. This eliminates the need for a centralized heat sink attached to a flat substrate, as each module's heat can be dissipated directly to ambient air through the bulb's transparent envelope.
Solution Approach 2:
The transparent bulb envelope serves as both the light transmission medium and the heat dissipation interface. Ambient air naturally convects heat away from the LED modules through the bulb surface, eliminating the need for active cooling systems or heavy metal heat sinks.
3Ease of manufacture
If all LEDs are mounted on a small flat substrate, then the manufacturing is simplified, but the light emission pattern differs from incandescent bulbs causing shadow lines and flux variations
Solution Approach 1:
The patent segments the LED array into multiple modules distributed across the bulb surface, with each module emitting light from a different location. This distributed emission pattern replicates the omnidirectional light distribution of incandescent filaments, eliminating shadow lines and providing uniform illumination in all directions.
Solution Approach 2:
The patent arranges LED modules to follow the spherical curvature of the bulb envelope, distributing light sources uniformly across the spherical surface. This spherical distribution mimics the isotropic radiation pattern of incandescent bulbs, ensuring consistent light emission in all directions without the directional bias of planar LED arrays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces heat-related costs and enhances energy efficiency by up to 30% while providing a light distribution similar to incandescent bulbs, minimizing shadow lines and flux variations, thus improving overall performance and user satisfaction.
Implementation Method 1
heat is usually highly concentrated within a small surface area
Implementation Method 2
Removing heat from such designs, using ambient air currents, is difficult
Data Source
AI summary
A solid state lamp includes a connector and a bulb portion with multiple strips.


