LED Strip with Varying Module Density for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lighting devices lack flexibility in heat dissipation and luminosity distribution, leading to inefficiencies and potential dark spots in lighting coverage, especially in LED-based systems where heat management and light intensity vary across different sections of a lighting apparatus.
Innovation Solution
The proposed solution involves an LED strip with multiple sections on an elongated substrate, each with varying densities of LED modules, power ratios, and heat dissipation belts of different widths and lengths, along with a lens structure and heat sinks to manage heat and light distribution uniformly across the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED modules are uniformly distributed across the elongated substrate, then the structure is simple and easy to manufacture, but heat dissipation is insufficient in high-density areas and luminosity distribution is uneven
Solution Approach 1:
The patent applies local quality by varying the density of LED modules across different sections of the elongated substrate. High-density sections are positioned in areas requiring greater luminosity, while low-density sections are placed in areas with lower lighting requirements. This non-uniform distribution optimizes heat dissipation by reducing thermal concentration in specific areas while maintaining appropriate light output levels.
Solution Approach 2:
The elongated substrate is divided into multiple sections with different LED module densities. Each section can be independently designed and manufactured, allowing for optimized heat dissipation and luminosity distribution. The segmentation enables different thermal management strategies for different parts of the lighting apparatus.
2Illumination intensity
If LED modules are densely packed to increase luminosity, then light output is improved, but heat accumulation increases and causes uneven light distribution with dark spots
Solution Approach 1:
Different sections of the lighting apparatus are designed with different LED module densities according to their specific lighting requirements. Areas requiring higher luminosity have denser LED arrangements, while areas prone to heat accumulation have lower density. This local optimization ensures adequate light output while preventing excessive heat buildup that would cause dark spots.
Solution Approach 2:
The patent varies the density parameter of LED modules across different sections of the substrate. By changing this parameter locally rather than maintaining a uniform density, the system achieves optimal balance between luminosity and heat management for each specific area of the lighting apparatus.
3Temperature
If heat dissipation belts are made wider to improve heat dissipation, then thermal management is enhanced, but the device structure becomes more complex and occupies more space
Solution Approach 1:
Heat dissipation belts are designed with varying widths according to the thermal load of different LED sections. Sections with higher LED density and greater heat generation are equipped with wider heat dissipation belts, while sections with lower density use narrower belts. This localized approach optimizes heat dissipation effectiveness while minimizing overall structural complexity and space occupation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for optimized heat dissipation and luminosity distribution, ensuring consistent light coverage and reducing dark spots by tailoring heat dissipation and light output to specific areas, enhancing the overall performance and efficiency of the lighting apparatus.
Implementation Method 1
A light-emitting diode (LED) is a semiconductor light source that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons. This effect is called electroluminescence.
Implementation Method 2
multiple heat dissipation belts (1001) are provided in the light tube (100). The multiple heat dissipation belts (1001) have a gap (1003) surrounding at a peripheral edge (1003) of each the multiple heat dissipation belts (1001).
Data Source
AI summary
A lighting apparatus includes a LED strip having an elongated substrate and multiple LED modules. A light passing cover enclosing the LED strip. The light passing cover have an extending linear surface with a main portion and a transition portion. A first cap and a second cap connect to the light passing cover. The first cap has a first connecting surface, a first contacting surface, and a first side surface. The second cap has a second connecting surface, a second contacting surface, and a second side surface. The first connecting surface and the second connecting surface provide a bridge connecting to the light passing cover. The first contacting surface and the second contacting surface have a transmission between an inner area and an external area of the light passing cover. The first side surface and the second side surface support a structure of the light passing cover.