LED Lamp Strip Manufacturing Using Scrollable Lead Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED lamp strip manufacturing processes face issues with high production costs and time due to the reflow process's adverse effects on LED packages and the need for multiple soldering of support members.
Innovation Solution
The manufacturing process involves using a scrollable lead frame with through holes in an adhesive tape, allowing LED packages to be mounted directly without reflow, and cutting the lead frame to desired lengths, eliminating the need for reflow and multiple soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the reflow process is applied to mount LED packages on the flexible circuit board, then the LED packages can be securely soldered, but the high temperature causes adverse effects on the LED packages
Solution Approach 1:
The patent extracts and eliminates the reflow process from the manufacturing sequence by pre-mounting LED packages onto the flexible circuit board before final assembly, thereby avoiding the harmful high-temperature exposure while maintaining secure soldering through alternative mounting timing
Solution Approach 2:
The LED packages are mounted onto the flexible circuit board in advance during the flexible PCB manufacturing process, before the final product assembly. This preliminary mounting action allows the soldering to be completed at a stage where subsequent high-temperature reflow processes can be avoided, thus protecting the LED packages from thermal damage
2Adaptability or versatility
If multiple support members are connected by soldering to form LED lamp strips of required length, then the desired length can be achieved, but the production cost and time are increased
Solution Approach 1:
The flexible circuit board is designed with segmented structures and pre-defined cutting positions that allow the final product to be divided into multiple sections of required lengths. This segmentation enables customization without requiring multiple soldering operations to connect separate support members, thereby reducing production time and cost
Solution Approach 2:
The flexible circuit board is manufactured with pre-configured LED package arrangements and pre-marked cutting positions during the initial manufacturing stage. This preliminary preparation allows for easy customization of final product lengths through simple cutting operations, eliminating the need for time-consuming multiple soldering processes to assemble different length configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and time by avoiding high-temperature reflow processes and minimizing soldering, while enabling flexible LED lamp strip production with improved efficiency.
Implementation Method 1
The adhesive tape is adhesively mounted to a top side of the support member and includes a plurality of through holes spaced from one another. Each of the LED packages extends through one of the through holes of the adhesive tape to be mounted to the top side of the support member.
Data Source
AI summary
A process of manufacturing an LED lamp strip includes the steps of forming a plurality of through holes on an adhesive tape, mounting the adhesive tape to a top side of a scrollable lead frame, bonding a plurality of LED chips to the top side of the scrollable lead frame according to the positions of the through holes, packaging the LED chips respectively, and finally cutting the scrollable lead frame. In light of this, the LED lamp strip can be produced under the circumstances of low production cost and less production time.