LED Strip Manufacturing via Segmented Conductive Lines and Avoidance Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing process for LED lighting strips faces issues with pseudo soldering, insecure soldering, and pin deformation due to direct soldering and cutting of power and signal lines, leading to a high failure rate and low reliability.
Innovation Solution
A method involving the use of conductive lines soldered to supporting bases with avoidance through-holes, allowing for easy stamp-cutting without damaging the supporting bases, and subsequent insulative sealing to enhance reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power line and signal line are directly soldered to pins and then signal line is cut off to form input and transmission lines, then manufacturing process is simple, but pseudo soldering or insecure soldering occurs and pin deformation happens leading to high failure rate
Solution Approach 1:
The supporting base is divided into multiple conductive portions with avoidance through-holes between them. The signal line is segmented into input and transmission lines by cutting at the avoidance through-hole location. This segmentation allows independent optimization of each segment's function while maintaining overall reliability.
Solution Approach 2:
The avoiding through-hole acts as an intermediary element between conductive portions. It provides a non-conductive barrier that prevents electrical interference while allowing mechanical support, and serves as the precise location for cutting the signal line without damaging adjacent pins.
2Reliability
If signal line is cut off to form signal input and transmission lines, then electrical connection is achieved, but pin deformation occurs easily
Solution Approach 1:
The avoidance through-hole is pre-formed in the supporting base at the exact location where the signal line needs to be cut. This preliminary preparation provides a predetermined cutting position that guides the cutting process, preventing deviation and avoiding damage to adjacent pins during the cutting operation.
3Productivity
If multiple LED lighting beads are manufactured, then production volume increases, but failure rate remains high due to soldering and cutting issues
Solution Approach 1:
The supporting base structure with multiple conductive portions and avoidance through-holes enables standardized segmentation of the signal line. This standardization allows for consistent cutting across multiple beads, reducing variability and improving overall pass rate while maintaining high production volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly increases the pass rate and manufacturing accuracy of LED lighting strips, improving their quality and reliability by preventing damage during the soldering and cutting processes.
Implementation Method 1
subjecting the supporting bases and the conductive lines to processing of soldering, so as to have each of the conductive lines soldered to two of the conductive portions
Implementation Method 2
subjecting the spanning portion to a processing of stamp-cutting so as to cut off, through stamping, the conductive line
Implementation Method 3
processing of insulative sealing the LED beads, the supporting bases and the conductive lines so that insulative sealing is realized on soldering portions between the LED beads and the supporting bases and/or soldering portions between the supporting bases and the conductive lines
Data Source
AI summary
A method for manufacturing an LED strip includes arranging conductive lines at intervals to extend along a first linear trace; arranging supporting bases at intervals along the first linear trace on the conductive lines, each supporting base including multiple conductive portions and an avoidance through-hole; each two multiple conductive portions arranged at intervals along the first linear trace, the avoidance through-hole disposed between two of the multiple conductive portions arranged along the first linear trace; soldering the supporting bases and the conductive lines so as to have each conductive line soldered to two of the conductive portions arranged along the first linear trace and one of the conductive lines spanning over the avoidance through-hole to form a spanning portion; stamp-cutting the spanning portion; disposing an LED bead on a surface of each of the supporting bases; and subjecting the LED bead and the conductive portions to a processing of soldering.