LED Illumination Sub Mounts for Light Extraction and Heat Dissipation
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Solution Overview
Problem
Existing illumination systems using light-emitting diodes (LEDs) have low efficacy due to inefficient light emission and heat management, leading to reduced performance and color accuracy.
Innovation Solution
The system employs a mounting substrate with two categories of LEDs, each on a sub mount, where InGaN LEDs are mounted with a translucent substrate and AlInGaP LEDs are shaped for enhanced light extraction, and both categories are connected via sub mounts with reflective and tilted surfaces to improve light distribution and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LEDs are mounted directly on the mounting substrate without sub mounts, then the device complexity is reduced, but the efficacy and packing density of the illumination system deteriorate
Solution Approach 1:
The patent introduces sub mounts as intermediary elements between the mounting substrate and the LED chips. These sub mounts serve as mediator structures that improve light extraction efficiency and thermal management without requiring complex direct mounting arrangements. The sub mounts act as intermediate optical and thermal management components that resolve the contradiction between simple mounting and high efficacy.
2Ease of manufacture
If LEDs are mounted directly on the mounting substrate, then the manufacturing process is simpler, but the packing density of the illumination system decreases
Solution Approach 1:
The mounting structure is segmented into multiple levels with sub mounts positioned at different heights. This segmentation allows LEDs to be mounted on elevated sub mounts, creating vertical spacing that increases the effective packing density on the mounting substrate. The segmented structure enables more LEDs to be accommodated in a given area while maintaining simple manufacturing processes.
3Device complexity
If conventional LED mounting is used without sub mounts, then the device structure is simpler, but heat management efficiency deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by positioning sub mounts at different heights above the mounting substrate. This dimensional arrangement creates optimized thermal pathways where heat can dissipate more effectively through the vertical spacing and improved contact areas with the mounting substrate, enhancing heat management without complicating the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the packing density and efficacy of the illumination system by enhancing light extraction and heat management, resulting in improved color homogeneity and efficiency, particularly for red LEDs, while maintaining comparable color accuracy.
Implementation Method 1
a first translucent substrate provided with an active layer on an outer surface of the first translucent substrate facing the mounting substrate
Implementation Method 2
both categories are connected via sub mounts with reflective and tilted surfaces to improve light distribution and heat dissipation
Implementation Method 3
AlInGaP LEDs are shaped for enhanced light extraction, and both categories are connected via sub mounts with reflective and tilted surfaces
Implementation Method 4
both categories are connected via sub mounts with reflective and tilted surfaces to improve light distribution and heat dissipation
Data Source
AI summary
An illumination system has a mounting substrate (4) for mounting and electrically contacting a plurality of light-emitting diodes (R, A, G, B). A first category of the light-emitting diodes (G, B) comprises a first translucent substrate (11) provided with an active layer (1) on an outer surface (13) of the first translucent substrate facing the mounting substrate (4); electrical contacts are provided at a side facing the mounting substrate. A second category of the light-emitting diodes (R, A) comprises an active layer (2) arranged on a second translucent substrate (12); at least one electrical contact is provided at a side facing away from the mounting substrate. Each light-emitting diode of the first category is provided on a first sub mount (21). Each light-emitting diode of the second category is provided on a second sub mount (22). The first and second sub mount are provided on the mounting substrate.