LED Submount with Independent Contacts for Flexible Voltage Design
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Solution Overview
Problem
Conventional light emitting devices have poor design flexibility and increased manufacturing costs due to LEDs being electrically connected in series during manufacturing, limiting the ability to produce devices with different driving voltages.
Innovation Solution
The use of flip-chip bonding allows for flexible electrical connections of LEDs in series or parallel through varying layouts of conductive contacts on a submount, enabling the creation of high voltage light emitting devices without pre-connection, thereby reducing manufacturing costs and improving design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LEDs are electrically connected in series in advance during manufacturing, then a high voltage light emitting device can be obtained, but design flexibility deteriorates and manufacturing cost increases
Solution Approach 1:
The patent segments the electrical connection function by separating the LED array from the submount with independent conductive contacts. Each LED can be independently connected to the submount through its own conductive contact, allowing post-assembly configuration of series/parallel connections rather than pre-fixed connections during manufacturing
Solution Approach 2:
The patent introduces dynamic configurability to the electrical connection system. By providing multiple conductive contacts on the submount that can be selectively connected to different LED terminals, the system can dynamically adjust its electrical configuration (series/parallel) after assembly, rather than being fixed during manufacturing
2Use of energy by moving object
If LEDs are electrically connected in series in advance during manufacturing, then a high voltage light emitting device can be obtained, but manufacturing cost increases
Solution Approach 1:
The patent segments the electrical connection function by separating the LED array from the submount with independent conductive contacts. Each LED can be independently connected to the submount through its own conductive contact, allowing post-assembly configuration of series/parallel connections rather than pre-fixed connections during manufacturing
Solution Approach 2:
The submount is designed with universal multi-functionality, incorporating multiple conductive contacts that can serve different connection purposes (series or parallel) depending on configuration. This universal design eliminates the need for different submount designs for different voltage requirements, reducing manufacturing complexity and cost
3Illumination intensity
If multiple LED dies are bonded to a submount, then light source intensity increases, but alignment precision requirements increase
Solution Approach 1:
The patent employs flip-chip bonding technology that bonds LEDs vertically to the submount, utilizing the vertical dimension for mounting. This vertical bonding approach simplifies alignment compared to planar arrangements, as the LEDs are positioned and bonded in the vertical direction, reducing the complexity of precision alignment requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the flexibility of light emitting device design, reduces manufacturing costs, and allows for the production of devices with a wide range of voltages from 15 volts to 400 volts, improving alignment precision and reliability.
Implementation Method 1
Light emitting diodes (LEDs) are advantageous in low power consumption, high efficient and long service life
Implementation Method 2
the light emitting unit (110) is provided with a plurality of first light emitting diodes (111)... the first light emitting diodes (111)... are driven to emit light rays
Implementation Method 3
The light emitting unit (110) is bonded to a side (a top surface) of the submount (120) through flip-chip bonding
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A light emitting device includes a light emitting unit and a submount. The light emitting unit has a plurality of light emitting diodes (LEDs), and the submount has a plurality of conductive contacts on a side thereof. The LEDs are coupled to the conductive contacts in various electrical connection manners, such that the LEDs are connected in series or/and in parallel.