LED Submount Reflective Layer and Adhesion Design
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Solution Overview
Problem
Current light emitting devices, such as LEDs, face challenges in achieving increased brightness, improved optical and thermal performance, and enhanced adhesion between layers, which are essential for efficient light emission and thermal management.
Innovation Solution
The development of light emitting devices with increased reflectivity and improved adhesion between layers, achieved through the use of reflective materials like titanium dioxide and optimized die attach methods, which enhance light reflection and thermal conductivity, and the integration of patterns of LEDs to minimize light absorption and maximize uniform light output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If reflective materials like titanium dioxide are added to improve light reflection, then brightness is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated submount structure that incorporates reflective surfaces, thermal management, and mechanical support functions, thereby improving brightness through enhanced light reflection without proportionally increasing device complexity
Solution Approach 2:
The submount is designed as a multi-functional component that simultaneously provides structural support, thermal dissipation, and optical reflection functions, allowing the device to achieve improved brightness while maintaining relatively simple overall structure
2Temperature
If die attach methods are optimized to improve thermal conductivity, then thermal performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent modifies physical and chemical parameters of the die attach process and materials, such as adjusting bonding temperatures, pressures, and material compositions, to achieve improved thermal conductivity while keeping manufacturing precision requirements within practical limits
Solution Approach 2:
The patent employs composite die attach materials that combine different substances with complementary properties to achieve high thermal conductivity while maintaining ease of manufacturing and acceptable precision requirements
3Illumination intensity
If patterns of LEDs are integrated to maximize uniform light output, then illumination uniformity is improved, but device complexity increases
Solution Approach 1:
The patent divides the LED array into multiple patterned sections or zones with different configurations, allowing each segment to contribute to uniform overall light output while maintaining a manageable level of individual component complexity
Solution Approach 2:
The patent applies different LED patterns, densities, or orientations in different local regions of the device to optimize light distribution uniformity across the entire output surface, rather than using a uniform pattern throughout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in brighter and more efficient light emitting devices with improved thermal performance and adhesion, leading to increased brightness and reliability, while also simplifying manufacturing processes by providing a uniform optical source.
Implementation Method 1
a first layer of material, such as a reflective material, disposed between at least a portion of the solder mask and the LED chip
Implementation Method 2
improved thermal performance
Data Source
AI summary
Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.