LED Lamp Submount Spring Contact Heat Sink Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED lighting systems face challenges in achieving efficient heat dissipation and secure electrical connections while maintaining a compact form factor, which can affect light quality and safety.
Innovation Solution
The design incorporates a heat sink with a thermally conductive portion and a flexible submount with spring contacts for efficient heat dissipation and secure electrical connections, ensuring the LEDs are positioned centrally within the lamp to minimize interference with the heat sink and mounting hardware, and uses a reflective surface to create a directional light pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If LEDs are positioned centrally within the lamp to minimize interference with heat sink and mounting hardware, then heat dissipation efficiency is improved, but the complexity of positioning and alignment increases
Solution Approach 1:
The submount is designed to integrate multiple functions: it serves as the mounting platform for LEDs, provides electrical connections through integrated contacts, and facilitates positioning relative to the heat sink. By combining these functions into a single component, the alignment complexity is reduced while maintaining central LED positioning for optimal heat dissipation.
Solution Approach 2:
The submount acts as an intermediary element between the LEDs and the heat sink, providing a structured interface that simplifies positioning. The submount's connector portion and electrical contacts serve as mediation structures that align LEDs centrally while managing thermal and electrical connections.
2Reliability
If spring contacts are used for secure electrical connections, then connection reliability is improved, but the device complexity increases
Solution Approach 1:
The electrical contacts are integrated directly into the submount structure, combining mechanical positioning and electrical connection functions in a single component. This reduces the number of separate parts needed for electrical connections while maintaining reliable contact through the spring mechanism.
Solution Approach 2:
The submount serves multiple functions simultaneously: it mounts the LEDs, provides electrical connections through integrated spring contacts, and facilitates thermal management. This multi-functionality reduces overall device complexity while maintaining connection reliability.
3Adaptability or versatility
If a compact form factor is maintained to replace traditional lighting systems, then adaptability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat sink is designed to extend in dimensions that utilize available space efficiently within the compact lamp form factor. By strategically positioning the heat sink and utilizing three-dimensional space, adequate heat dissipation surface area is achieved without increasing the overall lamp volume, maintaining compatibility with traditional fixtures.
Solution Approach 2:
The heat sink is positioned and sized to provide localized heat dissipation capability directly at the LED mounting location. This concentrated thermal management approach allows effective heat dissipation within the constraints of a compact form factor, maintaining adaptability to traditional lighting applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat management and secure electrical connections, maintaining light quality and safety by positioning LEDs centrally, allowing for a compact design that replaces traditional lighting systems while providing directional lighting.
Implementation Method 1
a heat sink with a thermally conductive portion and a flexible submount with spring contacts for efficient heat dissipation
Implementation Method 2
The first spring contact and the second spring contact may each comprise resilient conductors that are deformed to create the electrical contact coupling
Implementation Method 3
A reflective surface may be disposed in the enclosure. The reflective surface may generate a directional light pattern
Data Source
AI summary
A LED lamp comprises an enclosure containing a reflective surface and an optically transmissive exit surface and a base. A LED assembly is mounted on a submount, is located in the enclosure and is operable to emit light when energized through an electrical path from the base. The submount comprises a connector portion having a first electrical contact that is in the electrical path. A first spring contact is electrically coupled to lamp electronics where the lamp electronics and the first spring contact are in the electrical path. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the LED assembly. The connector portion is inserted into the heat sink such that the first electrical contact creates an electrical contact coupling with the first spring contact.