LED Substrate With Aerial Wire Bridging for Thermal Management
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Solution Overview
Problem
Existing LED light sources in automotive lighting and signaling systems face limitations in heat dissipation and positioning accuracy due to the use of metal substrates, which restrict cooling capacity and precision.
Innovation Solution
Implementing power LEDs on ceramic bases without a metal plate, using metal wires for electrical connections that extend aerially and are connected via bridging techniques like ultrasonic welding, ensuring precise positioning and enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal substrate is used to support the LED, then electrical connection is achieved, but cooling capacity is limited
Solution Approach 1:
The patent removes the metal substrate entirely from the LED support structure. Instead of using a metal substrate to support and cool the LED, the invention uses a ceramic substrate with integrated cooling channels that allow coolant to flow directly beneath the LED, extracting heat more efficiently without the thermal resistance of metal.
Solution Approach 2:
The patent employs a composite structure combining ceramic substrate material with integrated cooling channels. The ceramic provides electrical insulation and structural support, while the cooling channels (filled with coolant) provide superior thermal management, creating a multi-material system that outperforms single-material metal substrates.
2Ease of operation
If multiple components (diode, substrate, circuit board, reflector) are assembled together, then functional lighting system is created, but positioning accuracy deteriorates due to accumulated tolerances
Solution Approach 1:
The patent merges the substrate and reflector into a single integrated component. The reflector is formed as an integral part of the ceramic substrate structure, eliminating the separate assembly step and associated positioning tolerances. This integration ensures precise LED positioning relative to the reflector without accumulating errors from multiple assembly operations.
Solution Approach 2:
The patent segments the lighting system into modular components with standardized interfaces. The ceramic substrate assembly (containing LED, cooling channels, and integrated reflector) is designed as a self-contained module that can be precisely positioned and fixed to the circuit board, reducing the impact of tolerances across the entire assembly chain.
3Ease of manufacture
If conventional assembly methods are used, then manufacturing process is simple, but positioning precision and cooling efficiency are limited
Solution Approach 1:
The patent incorporates the reflector geometry directly into the ceramic substrate manufacturing process (such as injection molding or ceramic forming). The reflector shape is created during substrate fabrication rather than through subsequent assembly, ensuring precise positioning and eliminating the need for separate alignment operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves improved thermal management and positioning precision of LEDs, allowing for efficient heat dissipation and reduced tolerance in LED placement, enhancing lighting performance and reliability.
Implementation Method 1
The support comprises metal wires which extend aerially and which connect, by bridging, the electrical contacts of the light sources with the electrical contacts of the power supply control circuit
Implementation Method 2
connected via bridging techniques like ultrasonic welding
Implementation Method 3
power LEDs on ceramic bases without a metal plate, using metal wires for electrical connections
Data Source
Figure 1~2
Figure 3~5
AI summary
The invention relates to a substrate (2) for one or more light sources for a lighting and/or luminous signalling module for a motor vehicle, comprising a substrate (4) made of a heat-conducting material, preferably made of metallic material; at least one light source (12) such as a light-emitting diode, with a surface for mounting on the substrate (4), in thermal contact with the latter; and a circuit for controlling the power supply (10) of the one or more light sources (12). The circuit for controlling the power supply is electrically connected to the one or more light sources by means of metal wires welded on the surface (16) by the technology commonly referred to as "wire/ribbon bonding". The invention also relates to a method for assembling such a substrate.