LED Substrate Sealing Structure for Airtight Package Reliability
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Solution Overview
Problem
Existing electronic device packaging techniques fail to effectively extend the operating service life and reliability of light-emitting diode-based devices due to issues with air infiltration and structural integrity, leading to potential fractures and cracks.
Innovation Solution
The electronic device design incorporates a first substrate with light-emitting diodes, a transparent material layer, and a sealing material that surrounds the transparent layer, with the sealing material having a higher viscosity and curing properties to ensure a secure assembly and reduce air pockets between substrates, enhancing structural integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging techniques are used for LED devices, then the device can be assembled and function, but air infiltration and structural integrity issues occur leading to reduced service life and reliability
Solution Approach 1:
The sealing material is applied to the first substrate before assembly with the second substrate, creating a pre-formed seal structure that prevents air infiltration from the outset. This preliminary sealing action ensures that the bonding interface is protected against harmful air penetration during the assembly process and device operation, directly addressing the reliability issue without compromising assembly feasibility
Solution Approach 2:
The sealing material acts as an intermediary substance between the first substrate and second substrate, filling the bonding interface and creating a barrier that prevents air infiltration. This intermediary layer resolves the contradiction by providing a protective function that enhances reliability while maintaining the structural integrity of the packaged LED device
2Reliability
If the sealing material layer is made thicker to prevent air infiltration, then reliability improves, but the distance constraints and structural compactness are compromised
Solution Approach 1:
The sealing material's viscosity parameter is optimized to be higher than the transparent material layer, allowing it to maintain effective sealing at reduced thickness. This parameter change enables the sealing material to provide adequate air infiltration protection while maintaining compact device dimensions and proper distance relationships between substrates
3Strength
If the sealing material has higher viscosity to ensure secure assembly, then structural integrity improves, but the ease of application and assembly process becomes more difficult
Solution Approach 1:
The viscosity of the sealing material is specifically optimized to be higher than the transparent material layer, creating a balanced rheological profile. This parameter optimization ensures that the sealing material provides sufficient structural integrity and adhesion strength while remaining workable during the assembly process, resolving the contradiction between strength and ease of manufacture
Data Source
AI summary
The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.