Light Emitting Device Substrate Alignment Mark Formation
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices face challenges in achieving precise adjustment of cutting positions relative to mounting positions, leading to inefficiencies in size reduction and cost-effectiveness due to variance in cutting and mounting accuracy.
Innovation Solution
A method involving the formation of projection parts and alignment marks on a substrate using metal films and photolithography techniques, allowing for high-precision alignment and cutting of light emitting elements, thereby improving positional accuracy and enabling cost-efficient, miniaturized device production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the reflective member containing part is minimized in thickness to achieve downsizing, then the device size is reduced, but the variance in cutting positions relative to mounting positions increases, limiting downsizing and reducing yields
Solution Approach 1:
An alignment mark is introduced as an intermediary element between the mounting position and cutting position. The alignment mark serves as a reference that enables precise positioning of both the light emitting element and the subsequent cutting operation, decoupling the two processes from direct dependency on each other's precision.
Solution Approach 2:
The alignment mark is formed in advance before the light emitting element is mounted and before the cutting operation. This preliminary formation of the alignment mark establishes a fixed reference framework that guides both mounting and cutting operations, ensuring their relative positions are precisely controlled.
2Manufacturing precision
If greater variance in cutting positions is accepted, then the reflective member thickness must be increased to accommodate the variance, but this prevents downsizing
Solution Approach 1:
The alignment mark acts as a mediator that transfers positional information from the mounting stage to the cutting stage. By using this intermediary reference, the system can maintain high precision cutting positions even when some variance exists in the mounting process, without needing to increase the reflective member thickness.
3Productivity
If greater variance in cutting positions occurs, then yields deteriorate, but maintaining high precision increases manufacturing complexity
Solution Approach 1:
The formation of the alignment mark is merged with the existing photolithography process used for forming wiring patterns. By using the same resist material and exposure process, the alignment mark is created without adding separate manufacturing steps, thus improving yield without significantly increasing process complexity.
Solution Approach 2:
The resist material and exposure process serve multiple functions: forming the wiring patterns and forming the alignment mark. This multi-functionality reduces the number of separate processes needed, maintaining manufacturing simplicity while achieving high precision and improved yields.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate placement and cutting of light emitting devices, reducing the thickness of reflective members and improving yield, resulting in smaller, more cost-effective light emitting devices with enhanced light extraction efficiency.
Implementation Method 1
forming projection parts including a first projection part on each of the first wiring parts and a second projection part on each of the second wiring parts by forming a first metal film on a region including at least part of the first wiring parts and at least part of the second wiring parts and etching the first metal film using a resist having a predetermined shape for forming the projection parts
Implementation Method 2
forming at least one alignment mark by forming a second metal film on the substrate and etching the second metal film using a resist for forming the at least one alignment mark, wherein the resist for forming the projection parts and the resist for forming the at least one alignment mark are exposed to light in an identical step of exposing to light
Data Source
AI summary
A method of manufacturing a substrate for a light emitting device includes: forming wiring to form a plurality of first wiring parts and second wiring parts on/above an upper surface of a base member; forming projection parts including a first projection part on each of the first wiring parts and a second projection part on each of the second wiring parts by forming a first metal film on a region including at least parts of the first wiring parts and the second wiring parts and etching the first metal film using a resist for forming projection part; and forming an alignment mark by forming a second metal film on the substrate and etching the second metal film using a resist, wherein the resist for forming the projection part and the resist for forming alignment mark are exposed to light in an identical step of exposing to light.