LED Substrate Resin Covering for Light-Induced Base Protection
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Solution Overview
Problem
Semiconductor light-emitting devices using a substrate with a metal lead face issues with base member deterioration due to light exposure and improper electrical conduction, leading to mounting failures.
Innovation Solution
A semiconductor light-emitting device design featuring a substrate with a base member and conductive part, where the base member has a front and back surface, and a resin member covers at least a portion of the substrate, including a frame-shaped portion surrounding the semiconductor light-emitting element and a front-surface covering portion to reduce light exposure and ensure proper electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate with a metal lead is used to mount the LED chip, then electrical conduction is established, but the base member deteriorates due to exposure to light emitted from the LED chip
Solution Approach 1:
The substrate is divided into functionally distinct regions: a light-shielding portion that blocks light from reaching the base member, and a light-transmitting portion that allows light to pass through. This segmentation enables the substrate to simultaneously protect the base member from light-induced deterioration while maintaining electrical conduction functionality.
Solution Approach 2:
The substrate acts as an intermediary element between the LED chip and the base member. By incorporating light-shielding and light-transmitting portions, the substrate mediates the interaction between light and the base member, preventing direct exposure and thus deterioration, while still allowing necessary electrical connections.
2Reliability
If the conductive part has a specific shape or arrangement to ensure electrical conduction, then mounting reliability improves, but the base member may still be exposed to light and deteriorate
Solution Approach 1:
The conductive part is segmented into regions with different light transmission properties. The light-shielding portion provides both mechanical support for mounting and protection against light, while the light-transmitting portion allows light passage. This segmentation resolves the contradiction between ensuring mounting reliability and preventing light exposure.
3Reliability
If the resin member covers only the LED chip, then the LED is protected, but the base member remains exposed to light and continues to deteriorate
Solution Approach 1:
The light-shielding portion extends in the thickness direction of the substrate, creating a three-dimensional light-blocking structure. This dimensional extension allows the substrate to shield the base member from light at multiple levels, preventing deterioration while maintaining LED protection.
Data Source
AI summary
A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a resin member. The substrate includes a base member and a conductive part. The semiconductor light-emitting element is supported on the substrate. The resin member covers at least a portion of the substrate. The base member has a front surface and a back surface that face opposite to each other in a thickness direction. The conductive part includes a front portion formed on the front surface. The semiconductor light-emitting element is mounted on the front portion. The resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and a front-surface covering portion connected to the frame-shaped portion and covering a portion of the front surface of the base member that is exposed from the front portion.