LED Mounting Substrate Thermal Conduction via Bolt
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting element mounting substrates and devices face inefficiencies in heat dissipation, as conventional heatsinks alone are insufficient to manage the increasing temperature of LEDs, leading to reduced light emission.
Innovation Solution
A light emitting element mounting substrate with a multilayer structure comprising a copper metal plate, an insulating layer, and an electrode layer, where a screw hole with internal threads allows for improved heat transfer through a bolt or nut, and optionally includes a metal joint in the gap between the bolt and the metal plate to enhance conductivity, and small holes filled with a metal joint to increase contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is used to dissipate heat from the LED element, then heat dissipation is improved, but the heat dissipation effect is insufficient to maintain optimal operating temperature
Solution Approach 1:
The invention segments the heat dissipation path into multiple components: the substrate with through-holes, heat dissipation members inserted into the through-holes, and grease layers filling the gaps. This segmentation creates multiple parallel heat conduction channels, increasing the overall heat dissipation capacity and ensuring reliable thermal management to maintain stable light emitting amount.
2Temperature
If a grease layer is disposed between the substrate and heatsink to improve heat dissipation, then heat conduction is improved, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The grease layer is pre-disposed within the through-holes of the substrate before assembling the heatsink. This preliminary action ensures that the heat conduction interface is already prepared with optimal grease distribution, eliminating the need for complex post-assembly adjustments and simplifying the manufacturing process while maintaining high heat conduction efficiency.
3Temperature
If the metal plate thickness is increased to improve heat dissipation, then heat conduction path is improved, but the device complexity and material usage increase
Solution Approach 1:
Instead of uniformly increasing the metal plate thickness throughout the substrate, the invention places heat dissipation members with high thermal conductivity into specific through-holes at critical heat generation locations. This local quality approach concentrates heat dissipation resources where most needed, improving overall heat dissipation capacity without proportionally increasing device complexity or material usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively transfers heat generated by the LEDs to the heatsink, achieving a balanced and improved heat-dissipation effect, ensuring reliable thermal management and maintaining light emission performance.
Implementation Method 1
a substrate with the LED element mounted is fixed on a heatsink (also referred to as 'heat-dissipation member' as well) to dissipate heat generated in the LED element to the heatsink
Implementation Method 2
PTL 1 describes a technique for improving the heat-dissipation effect by disposing a grease layer between the substrate and the heatsink
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
Provided are a light emitting module and the like having a higher heat-dissipation effect. The light emitting module of the present disclosure includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.