Light-Emitting Module Substrate Depressions for Stronger Board Bonding
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Solution Overview
Problem
Existing light-emitting devices face challenges in maintaining mechanical strength of the base member while improving bonding strength to a mounting board, as conventional methods often compromise mechanical integrity for enhanced bonding.
Innovation Solution
The design incorporates depressed portions on the base member with varying depths and shapes, allowing for increased volume and area of bonding members, which enhances bonding strength without compromising mechanical strength, by ensuring the depressed portions do not penetrate through the base member and are strategically formed to distribute stress effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If depressions are formed on the mounting surfaces of supporting members to improve bonding strength, then the bonding strength to mounting board is improved, but the mechanical strength of the base member is decreased
Solution Approach 1:
The patent applies local quality by creating depressions only in specific regions of the base member where bonding is required, rather than uniformly modifying the entire structure. The depression depth varies from region to region, with deeper depressions in areas requiring stronger bonding and shallower or no depressions in areas requiring mechanical strength, thus optimizing both bonding strength and mechanical strength locally.
Solution Approach 2:
The patent introduces a depth dimension to the mounting surface by forming depressions with controlled depths. This vertical dimensionality allows the bonding member to be embedded deeper in specific areas to enhance bonding strength without compromising the overall mechanical strength of the base member, as the depression depth can be precisely controlled to avoid excessive material removal.
2Strength
If the depth of depressed portions is increased to increase bonding member volume, then bonding strength is improved, but mechanical strength of base member is compromised
Solution Approach 1:
The patent implements local quality by varying the depression depth across different regions of the base member. Some regions have deeper depressions to accommodate more bonding material for enhanced bonding strength, while other regions have shallower or no depressions to maintain mechanical strength. This spatial variation in depression depth allows simultaneous optimization of both bonding and mechanical properties.
Solution Approach 2:
The patent applies partial action by forming depressions with depths that are sufficient to improve bonding strength but not excessive to the point of compromising mechanical strength. The depression depth is carefully controlled to provide just enough additional bonding member volume to enhance bonding without removing excessive base member material that would weaken the structure.
Data Source
Figure 1A
Figure 1B~1C
Figure 2A
AI summary
A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.