LED Display Substrate Layout for Easier Chip Replacement
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Solution Overview
Problem
Existing display technologies, particularly those using light emitting diodes (LEDs), face challenges in efficient power consumption and response speed, and the repair process for defective LED chips is time-consuming and costly due to the need for surplus chips and adhesive residue removal.
Innovation Solution
A substrate design for LED-based displays with multiple interconnects and mounting portions allows for easy replacement of defective LED chips using a method that involves mounting new chips on separate adhesive portions with a lower melting point, reducing the need for surplus chips and simplifying the repair process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If traditional LED chip mounting method is used with single adhesive portion, then manufacturing process is simple, but repair of defective LED chips is time-consuming and costly requiring surplus chips and adhesive residue removal
Solution Approach 1:
The substrate divides the original single adhesive portion into multiple adhesive portions (first adhesive portion and second adhesive portion). This segmentation allows independent replacement of defective LED chips by enabling access to individual chips through separate adhesive removal, eliminating the need to remove all chips or perform complex adhesive residue cleanup.
Solution Approach 2:
The substrate includes pre-formed interconnect extensions that protrude from the interconnects before LED chip mounting. These extensions are prepared in advance to provide accessible bonding pads for future chip replacement, allowing repair personnel to easily connect new chips without complex routing work.
2Reliability
If surplus LED chips are kept for repair purposes, then repair reliability is improved, but manufacturing cost and inventory requirements increase
Solution Approach 1:
The substrate design enables repair personnel to perform self-service repairs by providing direct access to individual LED chips through separate adhesive portions. This eliminates the need to maintain large inventories of surplus chips, as repairs can be performed efficiently with minimal spare components.
3Manufacturing precision
If adhesive residue removal is performed during repair, then manufacturing precision is maintained, but repair time and process complexity increase
Solution Approach 1:
The design extracts the adhesive bonding function into separate, isolated adhesive portions for each LED chip. This allows the adhesive to be selectively removed only from the specific chip being replaced, rather than requiring removal of adhesive from the entire substrate or surrounding areas, significantly reducing repair time and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient repair of defective LED chips without the need for surplus chips, reducing manufacturing costs and time, while maintaining efficient power usage and response speed.
Implementation Method 1
A light emitting diode is an inorganic semiconductor device that emits light generated through recombination of electrons and holes
Implementation Method 2
The light emitting diode may be mounted on the first mounting portion via a first adhesive and the another light emitting diode may be mounted on the second mounting portion via a second adhesive
Data Source
AI summary
A display including a base and a plurality of light sources disposed on the base, at least one of the light sources including a first interconnect and one or more second interconnects, and a plurality of mounting regions on which a plurality of sub-light emitting devices is to be mounted, in which a first region of each of the plurality of mounting regions is electrically connected to the first interconnect, a second region of each of the plurality of mounting regions is electrically connected to one of the one or more second interconnects, and at least one of the plurality of sub-light emitting devices mounted on the plurality of mounting regions is configured to emit light of different wavelength.