Recessed LED Substrate Joining Strength via Curved Reflective Layer
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Solution Overview
Problem
Existing light emitting devices face challenges in enhancing the joining strength between the substrate and the reflective layer, which affects the overall performance and reliability of the device.
Innovation Solution
The design incorporates a substrate with a recessed structure that increases the contact area between the base member and the first reflective member, along with a light guide member and specific wavelength conversion members to improve light extraction efficiency and color rendering properties, while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional flat substrate structure is used, then the device structure is simple, but the joining strength between substrate and reflective layer is insufficient
Solution Approach 1:
The substrate incorporates a recessed portion with a curved bottom surface instead of a flat surface. This curvature increases the contact area between the substrate and the reflective layer, thereby improving joining strength. The curved surface allows for better mechanical interlocking and distribution of stresses, resolving the contradiction between structural simplicity and joining strength.
Solution Approach 2:
The invention transitions from a two-dimensional flat substrate surface to a three-dimensional recessed structure. By adding vertical depth and curvature to the substrate surface, the contact area with the reflective layer is significantly increased without substantially increasing the horizontal footprint of the device, thus improving joining strength while maintaining compact dimensions.
2Strength
If the contact area between substrate and reflective layer is increased, then the joining strength is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The recessed portion with its curved bottom surface can be efficiently manufactured using conventional semiconductor processing techniques such as photolithography, etching, and deposition. The curvature is formed through standard process steps that are already integrated into LED manufacturing workflows, minimizing the impact on manufacturing complexity while achieving enhanced joining strength.
3Illumination intensity
If a light guide member is added to improve light extraction efficiency, then the lighting performance is enhanced, but the device complexity increases
Solution Approach 1:
The light guide member serves multiple functions: it extracts light from the LED chip, provides structural support, and helps position other components such as the reflective layer and phosphor materials. By combining multiple functions into a single component, the overall device complexity is minimized while achieving improved light extraction efficiency.
4Illumination intensity
If wavelength conversion members are incorporated to improve color rendering, then the color quality is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The wavelength conversion members (phosphor materials) are integrated directly into the light guide member or positioned in close proximity within the recessed portion. This merging of components eliminates the need for separate assembly steps and simplifies the manufacturing process while achieving improved color rendering properties through effective wavelength conversion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the joining strength between the substrate and the reflective layer, improves light extraction efficiency, and increases color rendering properties, resulting in a more reliable and efficient light emitting device.
Implementation Method 1
a first light emitting element electrically connected with corresponding ones of the first wiring portions and disposed on the corresponding ones of the first wiring portions, the first light emitting element having an emission peak wavelength of 430 nm or greater and less than 490 nm
Implementation Method 2
a light guide member covering the first light emitting element, the second light emitting element and the upper surface of the base member
Implementation Method 3
a first reflective member having a closed-ring shape surrounding the upper surface of the base member and the light guide member, and being in contact with the light guide member
Data Source
AI summary
A light emitting device includes: a substrate including a base member including an upper surface, a lower surface and one or more lateral surfaces, and defining a recess that is opened at the upper surface and the lateral surfaces and surrounds an outer perimeter of the upper surface; a first light emitting element; a second light emitting element; a light guide member covering the first and the second light emitting elements and the upper surface of the base member; and a first reflective member having a closed-ring shape surrounding the upper surface of the base member and the light guide member, a portion of the first reflective member being located in the recess. At least one of the lateral surfaces of the base member and corresponding at least one of one or more outer lateral surfaces of the first reflective member are in the same plane.