LED Substrates with Multi-Layer Dielectric Protection
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Solution Overview
Problem
Existing substrates for top-side contact LEDs are prone to damage from environmental elements, leading to cracking and pinholes in the dielectric layer, which compromises light emission output and reliability.
Innovation Solution
The use of improved substrates with multiple dielectric layers and encapsulating materials, such as silicon oxide and titanium dioxide, applied in various thicknesses and configurations to prevent damage and enhance reflectivity, along with embedding LEDs in fill material to secure them and optimize light reflectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single dielectric layer is used to cover the reflective layer, then the structure is simple and manufacturing is easy, but the dielectric layer is susceptible to cracking and pinholes from environmental elements
Solution Approach 1:
The single dielectric layer is divided into multiple dielectric layers (first dielectric layer and second dielectric layer) with different material compositions and thicknesses. The first dielectric layer has a first thickness and the second dielectric layer has a second thickness greater than the first thickness, creating a segmented structure that improves reliability while maintaining manufacturability through standardized layering processes.
Solution Approach 2:
Different dielectric materials are used for the first and second dielectric layers, creating a composite structure. The first dielectric layer uses one material composition while the second dielectric layer uses a different material composition, allowing each layer to provide specific protective functions that together enhance overall reliability against environmental elements.
2Productivity
If the dielectric layer is made thinner to reduce processing time and cost, then processing is faster and cheaper, but the layer becomes more susceptible to damage from environmental elements
Solution Approach 1:
Instead of increasing the thickness of a single dielectric layer, the solution adds another dimension by introducing multiple dielectric layers with different thicknesses. The first dielectric layer has a first thickness and the second dielectric layer has a second thickness greater than the first thickness, providing enhanced protection without requiring excessive thickness in any single layer.
Solution Approach 2:
Different regions of the dielectric structure have different thicknesses and material compositions optimized for their specific functions. The first dielectric layer has a smaller thickness suitable for its protective role, while the second dielectric layer has a greater thickness providing enhanced environmental protection, with each layer's properties locally optimized for its position in the structure.
3Device complexity
If cracks or pinholes develop in the dielectric layer, then manufacturing is simpler, but light migration occurs causing dark spots that compromise emission output
Solution Approach 1:
The multi-layer dielectric structure provides beforehand cushioning against crack and pinhole formation. The first dielectric layer with smaller thickness and the second dielectric layer with greater thickness work together to prevent environmental elements from causing defects that would lead to light migration and dark spots, maintaining emission output consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more reliable, efficient, and cost-effective LED devices with consistent and uniform light emission, reducing defects and improving sulfur resistance.
Implementation Method 1
Top-side contact LEDs can be mounted to a substrate having a reflective layer to optimize light output and efficiency
Implementation Method 2
the dielectric layer in some substrates is susceptible to cracking, developing pinholes or otherwise degrading
Data Source
AI summary
Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.