LED Package Substrate Diffusion Layer for Static Protection
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Solution Overview
Problem
Conventional light emitting device packages require additional space and complexity due to the need for a Zener diode for protection against static electricity and reverse voltage, leading to increased size, weight, and manufacturing costs, and are not suitable for miniaturization.
Innovation Solution
A light emitting device package is designed using bulk micro machining technology to form a diffusion layer in the substrate, eliminating the need for a separate Zener diode by creating a mounting groove and using flip chip bonding, which integrates a protection circuit within the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Zener diode is mounted in the light emitting device package for protection against static electricity and reverse voltage, then the reliability of the light emitting device is improved, but the package size and weight increase
Solution Approach 1:
The patent merges the protection function into the substrate by forming a diffusion layer directly in the substrate material. This integrates the protection circuit with the package structure, eliminating the need for a separate Zener diode component and reducing overall package weight while maintaining protection functionality.
Solution Approach 2:
The substrate is given multiple functions: it serves as both the mechanical support structure and as the protection circuit element through the diffusion layer. This multi-functionality eliminates the need for separate protection components, reducing package weight and complexity.
2Reliability
If a Zener diode is mounted in the light emitting device package for protection against static electricity and reverse voltage, then the reliability of the light emitting device is improved, but the device complexity increases
Solution Approach 1:
The protection circuit is merged with the substrate structure through the diffusion layer formation. This integration reduces the number of discrete components and simplifies the overall package structure while maintaining the protection function against static electricity and reverse voltage.
Solution Approach 2:
The substrate performs dual functions as both structural support and protection circuit element. This multi-functionality reduces device complexity by eliminating separate protection components and their associated mounting and wiring requirements.
3Reliability
If a Zener diode is mounted in the light emitting device package for protection against static electricity and reverse voltage, then the reliability of the light emitting device is improved, but the manufacturing cost increases
Solution Approach 1:
The protection function is merged into the substrate manufacturing process through diffusion layer formation. This integration eliminates the need for separate Zener diode components and their associated mounting, wiring, and assembly steps, thereby reducing manufacturing cost while maintaining protection reliability.
Solution Approach 2:
The substrate serves multiple functions including structural support and protection circuit operation. This multi-functionality reduces the total component count and assembly steps required, leading to lower manufacturing costs while ensuring protection against static electricity and reverse voltage.
4Reliability
If wire bonding and leads are used in the light emitting device package, then the electrical connection is established, but the light emission efficiency is reduced
Solution Approach 1:
The patent removes wire bonding and leads from the package structure by forming direct electrical connections through the substrate's diffusion layer. This extraction of unnecessary components eliminates light blocking elements, thereby improving light emission efficiency while maintaining reliable electrical connection through the integrated substrate structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the package size and weight, simplifies the manufacturing process, and enhances light emission efficiency by eliminating the need for wire bonding and leads, while providing effective protection against static electricity and reverse voltage.
Implementation Method 1
a diffusion layer is formed in a lower part of a substrate such that the diffusion layer is electrically connected in parallel with a light emitting device
Implementation Method 2
a light emitting device, such as a light emitting diode or a laser diode, using Group III to IV or Group II to VI compound semiconductor materials of a direct transition compound semiconductor to emit various color light
Data Source
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AI summary
A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from the package structure by an insulation film. The first and second electrodes are electrically connected with the two diffusion layers, respectively.