Light Emitting Device Substrate Edge Alignment
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Solution Overview
Problem
Conventional light emitting devices have a larger volume due to their packaging design, which does not meet the demands for thinning and miniaturization of devices, as they require a larger carrier board and arc-shaped molding compound for packaging.
Innovation Solution
A light emitting device with a substrate, electrode connection layer, epitaxial structure, and pads, where the electrode connection layer's edge is aligned with the substrate edge, allowing for a smaller volume by eliminating the need for a larger carrier board and using a sheet-like wavelength converting layer with micron-scale voids for improved light emission and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a larger carrier board and arc-shaped molding compound are used for packaging, then the light emitting device has better structural stability and electrical connection, but the volume of the device increases
Solution Approach 1:
The patent merges the carrier board and molding compound functions into a single integrated substrate structure. The substrate directly provides both mechanical support and electrical connection functions, eliminating the need for separate carrier boards and arc-shaped molding compounds, thus reducing device volume while maintaining structural stability.
Solution Approach 2:
The patent extracts and eliminates the unnecessary carrier board and arc-shaped molding compound from the traditional packaging structure. By removing these redundant components and integrating their essential functions into the substrate, the device achieves miniaturization without compromising reliability.
2Volume of stationary object
If the electrode connection layer edge is aligned with the substrate edge, then the device volume is reduced, but the manufacturing precision requirement increases
Solution Approach 1:
The patent performs preliminary alignment of the electrode connection layer with the substrate edge during the substrate fabrication process itself, rather than as a subsequent assembly step. This integrated approach reduces the cumulative tolerance errors that would arise from multiple assembly operations, making the high-precision alignment more achievable.
3Use of energy by moving object
If a sheet-like wavelength converting layer with micron-scale voids is used, then light emitting efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent employs a sheet-like wavelength converting layer containing micron-scale voids (porous structure). This porous configuration increases the surface area and light interaction pathways, thereby improving light emitting efficiency. The voids allow for better light extraction and reduced total internal reflection within the layer.
Solution Approach 2:
The wavelength converting layer is constructed as a composite material system combining the sheet-like structure with micron-scale voids. This composite architecture integrates multiple functional characteristics: the sheet provides structural support and wavelength conversion, while the voids enhance light extraction efficiency, achieving improved performance without proportionally increasing manufacturing complexity.
Data Source
AI summary
A light emitting device includes a substrate, an electrode connection layer, an epitaxial structure and a plurality of pads. The substrate has an upper surface, a lower surface and a plurality of conductive through holes. The electrode connection layer is disposed on the upper surface of the substrate, and connects with the conductive through holes. An edge of the electrode connection layer is aligned with an edge of the substrate. The epitaxial structure is disposed on the electrode connection layer and electrically connected to the electrode connection layer. The pads are disposed on the lower surface of the substrate and connect with the conductive through holes.