LED Device with Substrate-Integrated Electrode and Concave Housing

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Solution Overview

Problem

Conventional LED devices are thick due to the size of the substrate and reflective cup, which limits their compactness and efficiency in light emission.

Innovation Solution

The LED device design eliminates the need for a reflective cup by using an electrode board with a concave portion to house the LED chip and encapsulant, reducing the device's thickness and size, and employing a method that involves forming insulated electrode preforms, molding to create convex and concave portions, and binding substrates with electrode boards, followed by encapsulant application and cutting to produce individual LED devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a reflective cup is used to reflect light outward, then light emission efficiency is improved, but device thickness increases

Engineering Contradiction:
Improvelight emission efficiencyVSAvoiddevice thickness
Core Design Contradiction:
Illumination intensityVSLength of stationary object

Solution Approach 1:

The patent merges the reflective cup function with the substrate by forming a reflective layer directly on the substrate surface. This integration eliminates the need for a separate reflective cup structure, thereby maintaining light reflection efficiency while reducing overall device thickness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the reflective function from the traditional reflective cup structure and relocates it to the substrate surface. This separation allows the removal of the bulky reflective cup while preserving the light reflection capability through the substrate-integrated reflective layer.

Inventive Principle:
Principle #2Taking out (Extraction)

2Stability of the object's composition

If a substrate and reflective cup structure is used, then structural stability is improved, but device complexity increases

Engineering Contradiction:
Improvestructural stabilityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the substrate: structural support, light reflection, and LED chip mounting. By integrating the reflective layer into the substrate, the design reduces the number of separate components while maintaining structural integrity, thereby simplifying the overall device architecture.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to serve multiple purposes: providing structural stability, reflecting light through the integrated reflective layer, and supporting the LED chip. This multi-functional design eliminates the need for separate reflective cups and mounting structures, reducing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design results in a thinner, more compact LED device with improved light reflection and reduced size, maintaining high luminosity and reliability while eliminating the need for a separate reflective cup.

Implementation Method 1

light emitted from the LED can be reflected outward by the reflective cup for illuminating

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS9318666B2Light emitting diode device and method for manufacturing same
Publication Date: 2016.04.19 ADVANCED OPTOELECTRONIC TECH INC
  • US9318666B2 patent drawing
  • US9318666B2 patent drawing
  • US9318666B2 patent drawing

AI summary

An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided.