LED Optoelectronic Device Substrate Encapsulation
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Solution Overview
Problem
Current methods for manufacturing optoelectronic devices with light-emitting diodes, particularly those using semiconductor microwires or nanowires, face challenges such as the need for individual protective casings and large device sizes relative to the active area, leading to increased costs and complexity.
Innovation Solution
A method involving the simultaneous formation of light-emitting diodes on a semiconductor substrate, followed by collective encapsulation of all diodes with a protective layer before cutting the substrate, eliminating the need for individual casings and reducing the device size by ensuring the encapsulation layer continues to protect the diodes after separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual protective casings are used for each optoelectronic device, then the light-emitting diodes are protected, but the device size becomes large relative to the active area and manufacturing complexity increases
Solution Approach 1:
The patent merges the protective function from individual device-level casings to a substrate-level encapsulation layer. The encapsulation layer is formed over the entire substrate containing multiple light-emitting diodes, providing collective protection instead of requiring separate casings for each device. This reduces manufacturing steps and overall device complexity while maintaining protection.
Solution Approach 2:
The encapsulation layer serves multiple functions simultaneously: it protects all light-emitting diodes on the substrate, acts as a structural component, and enables subsequent cutting and mounting operations. This multi-functional approach eliminates the need for dedicated individual protective casings, reducing both complexity and size.
2Reliability
If individual protective casings are used for each optoelectronic device, then the light-emitting diodes are protected, but the device size becomes large relative to the active area
Solution Approach 1:
By combining the protection function across the entire substrate rather than requiring individual casings for each device, the overall device footprint is reduced. The encapsulation layer provides protection for multiple devices simultaneously, eliminating the need for separate casing structures that would increase the total area.
3Ease of manufacture
If protective casings are eliminated and only substrate-level encapsulation is used, then manufacturing cost and complexity are reduced, but protection of light-emitting diodes must be maintained
Solution Approach 1:
The encapsulation layer is formed over the substrate before the light-emitting diodes are mounted and before final device assembly. This preliminary protective action ensures that the diodes are protected from the beginning of the manufacturing process through to final assembly, maintaining reliability while enabling simplified manufacturing steps.
Solution Approach 2:
The substrate-level encapsulation layer combines the protective function that would otherwise require individual casings for each device. This merged approach maintains comprehensive protection while significantly reducing manufacturing complexity and cost by eliminating multiple separate casing operations.
Data Source
Figure 1~2D
Figure 2E~5
Figure 6A~8
AI summary
The invention relates to a method for manufacturing optoelectronic devices comprising the following successive steps: providing a substrate (10) having insulation trenches; forming, on the first face, assemblies of light-emitting diodes comprising wire, conical or frustoconical semiconductor elements; covering the entire first face with a layer (40) encapsulating the light-emitting diodes; reducing the thickness of the substrate; and cutting the resulting structure to separate each assembly of light-emitting diodes.