LED Substrate Heat Sink Plate Patterned Area Light Mixing
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Solution Overview
Problem
The existing LED manufacturing process is complex and costly due to separate manufacturing of red, green, and blue LEDs, which leads to color deviations and poor heat-proof performance, and requires additional processes for packaging, including heat management and protection from oxygen and moisture.
Innovation Solution
An LED apparatus with a heat sink plate having a patterned area between substrate layers, incorporating fluorescence for color conversion, a black sealant, and a glass layer for protection, along with a metallic material for light reflection, to enhance heat sink performance and simplify the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If three LEDs (red, green, blue) are manufactured separately and combined into one pixel, then color accuracy can be achieved, but the manufacturing process becomes complex and costly with many color deviations occurring due to temperature and environment
Solution Approach 1:
The patent merges the manufacturing of red, green, and blue LEDs into a single integrated structure where a blue LED chip is combined with red and green quantum dots on the same substrate. This allows all three colors to be manufactured simultaneously in one process rather than separately assembling three distinct LEDs, thereby reducing manufacturing complexity while maintaining color accuracy.
Solution Approach 2:
The blue LED chip serves multiple functions: it acts as the blue light source and simultaneously serves as the excitation source for converting red and green quantum dots. This multi-functionality reduces the need for separate light sources and simplifies the overall manufacturing process while maintaining precise color control.
2Manufacturing precision
If quantum dot is adhered on top of LED for color conversion, then red and green colors can be achieved, but the quantum dot is heated and deteriorates optical conversion characteristics
Solution Approach 1:
The patent introduces a reflective layer and heat sink structure as intermediaries between the blue LED chip and the quantum dots. The reflective layer directs heat away from the quantum dots while the heat sink dissipates thermal energy, protecting the temperature-sensitive quantum dots from excessive heating that would deteriorate their optical conversion characteristics.
Solution Approach 2:
The patent positions the quantum dots in a specific spatial arrangement relative to the blue LED chip, placing them at locations where they can be excited by blue light but are shielded from direct heat exposure. This spatial dimensionality change allows the quantum dots to perform color conversion while being protected from thermal deterioration.
3Reliability
If separate packaging processes are used for each LED wafer, then individual LED protection is achieved, but the process is complicated and raw material costs increase
Solution Approach 1:
The patent combines the packaging of multiple LED chips and quantum dots into a single integrated package structure. Instead of separately packaging each LED wafer, the entire assembly including the blue LED chip, red and green quantum dots, reflective layer, and heat sink is packaged together as one unit, significantly simplifying the packaging process while maintaining protection from environmental factors.
4Manufacturing precision
If patterned area is provided between adjacent substrate layers in heat sink plate, then light mixing is prevented, but manufacturing complexity increases
Solution Approach 1:
The patent uses a patterned area in the heat sink plate that corresponds to the spatial arrangement of different color sub-pixels. The patterned area selectively reflects or absorbs specific wavelengths of light, preventing light mixing between adjacent red, green, and blue sub-pixels while maintaining a relatively simple overall heat sink structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat sink performance, reduces manufacturing complexity and costs, and extends the product life by preventing light mixing and heat transfer, while also protecting the LED from environmental factors.
Implementation Method 1
a fluorescence provided on the heat sink plate overlapping at least a portion of one of the plurality of substrate layers... the fluorescence may include: a first fluorescence which is provided on a first side of a first substrate layer... corresponding to an R sub-pixel... and a second fluorescence which is provided on a first side of a second substrate layer... corresponding to a G sub-pixel
Implementation Method 2
a heat sink plate provided on a first side of the plurality of substrate layers... improves heat sink performance
Implementation Method 3
The patterned area of the heat sink plate is configured to prevent lights emitted from the plurality of light emitting diodes and passing through the plurality of substrate layers from mixing with one another
Implementation Method 4
a glass layer provided on the black sealant and the fluorescence... protecting the LED from environmental factors
Data Source
Figure 1~3
Figure 4a~6
Figure 7~10
AI summary
An LED apparatus is provided. The LED apparatus includes a plurality of substrate layers, each substrate layer corresponding to one of a plurality of sub-pixels of a pixel; a heat sink plate provided on a first side of each substrate layer, the heat sink plate including a patterned area provided between adjacent substrate layers of the plurality of substrates layers; a fluorescence provided on the heat sink plate overlapping at least a portion of one of the plurality of substrate layers; and a plurality of light emitting diodes, each light emitting diode formed on a second side opposite to the first side of each substrate layer.