LED Substrate Inclined Sidewalls Light Extraction

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Solution Overview

Problem

Light emitting diodes (LEDs) suffer from low light extraction efficiency due to total internal reflection of photons within the semiconductor structure, leading to absorption and reduced output.

Innovation Solution

The method involves epitaxially growing a light emitting structure on a substrate and scribing it to form angled side surfaces, where the surface tangent vector forms angles between approximately ten and eighty degrees with the substrate normal, followed by cleaning to enhance light extraction by mitigating total internal reflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If LED emits light uniformly in different directions, then light is emitted in all directions, but most light is totally internally reflected and trapped in the semiconductor structure

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidlight trapping
Core Design Contradiction:
Illumination intensityVSLoss of energy

Solution Approach 1:

The patent applies asymmetry by forming inclined sidewalls on the LED substrate at specific angles (10-80 degrees from vertical) to break the symmetry of light propagation. This asymmetric geometry redirects light paths to escape the total internal reflection that occurs in conventional planar LEDs, thereby improving light extraction efficiency while reducing light trapping losses.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent introduces a dimensional change by transitioning from a planar (2D) substrate surface to a three-dimensional structure with inclined sidewalls. This geometric modification adds angular dimensionality to light extraction, creating additional escape paths for photons that would otherwise be trapped, thus improving light extraction efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If substrate is scribed to form angled side surfaces, then light extraction efficiency increases, but manufacturing complexity increases

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidsubstrate shaping
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the inclined sidewalls on the substrate before epitaxial growth of the light-emitting layers. This pre-shaping of the substrate simplifies subsequent fabrication steps, as the light-extraction-optimizing geometry is already in place, reducing overall manufacturing complexity despite the initial shaping step.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly increases light extraction efficiency, with experimental results showing improvements in power and external quantum efficiency, particularly when combined with reflective coatings and optimized scribing angles.

Implementation Method 1

A large fraction of emitted light is totally internally reflected and trapped in the semiconductor structure

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

semiconductor layers with high indexes of refraction

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 3

epitaxially growing a light emitting structure on a surface of a substrate

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS9595636B2Light emitting device substrate with inclined sidewalls
Publication Date: 2017.03.14 SENSOR ELECTRONIC TECHNOLOGY INC
  • US9595636B2 patent drawing
  • US9595636B2 patent drawing
  • US9595636B2 patent drawing

AI summary

A light emitting device having improved light extraction is provided. The light emitting device can be formed by epitaxially growing a light emitting structure on a surface of a substrate. The substrate can be scribed to form a set of angled side surfaces on the substrate. For each angled side surface in the set of angled side surfaces, a surface tangent vector to at least a portion of each angled side surface in the set of angled side surfaces forms an angle between approximately ten and approximately eighty degrees with a negative of a normal vector of the surface of the substrate. The substrate can be cleaned to clean debris from the angled side surfaces.