LED Substrate Segmentation for High-Voltage Insulation
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Solution Overview
Problem
Existing optoelectronic devices with light-emitting diodes, such as those using semiconductor microwires or nanowires, face challenges in having a simple structure, separate control over individual diodes, and scalability for industrial production at low cost, while also being compatible with high voltages.
Innovation Solution
The design includes a substrate with insulation trenches filled with insulating blocks or conductive elements, allowing for separate control of light-emitting diodes with conical or frustoconical semiconductor elements, and a method for manufacturing these devices involving etching, forming electrode and conductive layers, and encapsulation, enabling efficient electrical insulation and high-voltage operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation trenches are filled with insulating blocks and gaseous volume or conductive elements, then electrical insulation between substrate portions is improved, but device structure becomes more complex
Solution Approach 1:
The substrate is divided into electrically isolated portions by insulation trenches that extend through the entire substrate thickness. Each trench is independently filled with insulating blocks and gaseous volume or conductive elements, creating segmented electrical zones that can be independently controlled while maintaining overall structural integrity.
Solution Approach 2:
The insulation trenches act as intermediary structures between adjacent substrate portions, providing electrical isolation while allowing mechanical support. The trenches are filled with specific materials (insulating blocks with gaseous volume or conductive elements) that mediate between the need for electrical isolation and structural continuity.
2Productivity
If multiple light-emitting diodes are formed on the same substrate, then production efficiency is improved, but separate control of individual diodes becomes more difficult
Solution Approach 1:
The substrate is segmented into multiple electrically isolated portions by through-extending insulation trenches. Each portion can host light-emitting diodes that are electrically independent, allowing separate control of individual diodes or groups of diodes while maintaining high production efficiency through batch fabrication on the same substrate.
3Adaptability or versatility
If the device is designed for high-voltage operation, then voltage range is improved, but electrical insulation requirements become more stringent
Solution Approach 1:
The insulation trenches filled with insulating blocks and gaseous volume or conductive elements serve as intermediary structures that provide enhanced electrical isolation for high-voltage operation. The trenches extend through the entire substrate thickness, creating effective barriers against electrical breakdown while allowing the device to operate across a wide voltage range from 1.5 V to 400 V.
4Reliability
If insulation trenches are completely filled with solid insulating material, then electrical insulation is improved, but mechanical stresses increase
Solution Approach 1:
The insulation trenches are filled with a composite structure combining solid insulating blocks with gaseous volume, rather than completely filling with solid material. This local quality change maintains electrical insulation where needed while reducing mechanical stresses by introducing compressible gaseous spaces that can accommodate thermal expansion and mechanical deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a simpler structure, enabling separate control of light-emitting diodes, facilitating industrial-scale, low-cost production, and allowing operation with high voltages from 1.5 V to 400 V, while reducing mechanical stresses and improving electrical insulation.
Implementation Method 1
insulation trenches extending through the substrate from the first surface to the second surface, surrounding portions of the substrate and electrically insulating the portions from each other
Implementation Method 2
at least one light-emitting diode resting on the first surface for each portion of the substrate, the light-emitting diodes comprising wired, conical, or frustoconical semiconductor elements
Data Source
AI summary
An optoelectronic device including a substrate having opposite first and second surfaces; insulation trenches extending through the substrate, surrounding portions of the substrate and electrically insulating the portions from each other, each insulation trench being filled with at least one electrically insulating block and a gaseous volume or being filled with an electrically conductive element electrically isolated from the substrate; at least one light-emitting diode resting on the first surface for each portion of the substrate, the light-emitting diodes comprising wired, conical, or frustoconical semiconductor elements; an electrode layer covering at least one of the light-emitting diodes and a conductive layer overlying the electrode layer around the light-emitting diodes; and a layer encapsulating the light-emitting diodes and covering the entire first surface.