LED Metal Substrate Insulator Creepage Path Design
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Solution Overview
Problem
Existing LED metal substrates face challenges in achieving high breakdown voltage levels due to dimensional limitations, leading to poor safety performance in lighting applications, as they often fail to prevent electric breakdown effectively.
Innovation Solution
The implementation of insulators on the LED metal substrate and module to cover electrodes and metal layers, or create new creepage paths, increasing the creepage distance between these components to enhance breakdown voltage levels without increasing the substrate's dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulator thickness or creepage distance is increased to improve breakdown voltage, then safety performance improves, but substrate dimension increases
Solution Approach 1:
The patent transitions from increasing creepage distance in the horizontal plane to increasing insulation thickness in the vertical dimension. By stacking insulating layers (first insulator covering electrode, second insulator covering metal layer) above and below the circuit board, the patent achieves required breakdown voltage levels without expanding the substrate footprint.
Solution Approach 2:
The patent employs multiple insulating layers nested at different levels: the first insulator nests around the electrode on the upper surface, the second insulator nests around the metal layer on the lower surface, and via hole insulators nest within the via holes. This nested structure maximizes insulation effectiveness within the constrained substrate volume.
2Reliability
If via hole insulation is added to improve breakdown voltage, then safety performance improves, but device complexity increases
Solution Approach 1:
The patent applies insulation selectively to critical areas where breakdown risks exist: via holes near electrodes receive insulating treatment (either insulative glue filling or insulative sleeves), while other areas use standard insulating layers. This localized approach addresses safety concerns without unnecessarily complicating the entire structure.
Solution Approach 2:
The patent introduces insulative glue or insulative sleeves as intermediary materials within via holes to prevent electrical breakdown. These intermediaries fill the gap between conductive elements and provide localized insulation without requiring major structural redesigns.
Data Source
AI summary
The present disclosure provides a LED metal substrate and a LED module. An insulator is provided to cover an electrode or a side surface of a metal layer in the LED metal substrate, or provided on an original creepage path between the electrode and the metal layer in the LED metal substrate to form a new creepage path with increased creepage distance, in order to increase the breakdown voltage between the electrode and the metal layer. It is possible to avoid a phenomenon that an electric arc is generated between the electrode and the metal layer when a relative high voltage applied by the electrode during a breakdown test. So that the breakdown voltage of the LED metal substrate with an insulator reaches higher than that of a LED metal substrate without the insulator in the same dimension, and a technical problem in the art may be solved.