Light-emitting device substrate with lateral wall bonding regions
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Solution Overview
Problem
Conventional light-emitting devices face challenges in achieving high light extraction efficiency and are prone to damage during handling and mounting due to stress concentrations at the bonding interfaces between the substrate and the light-transmissive member.
Innovation Solution
The design incorporates a substrate with specific surface regions and a light-transmissive member with projections and peripheral portions, along with strategically placed bonding members to enhance bonding strength and reduce stress, while maintaining areas for stable suction and improved light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the light-transmissive member is bonded directly to the substrate at the corners, then the bonding strength is maximized, but the device is prone to damage during handling and mounting due to stress concentrations
Solution Approach 1:
The patent applies local quality by creating different surface configurations in different regions of the substrate. Specifically, the fourth side (opposite the light-exiting surface) has a different surface structure compared to other sides, allowing for localized stress management while maintaining overall bonding integrity. This regional differentiation reduces stress concentration at critical corners during handling and mounting operations.
2Strength
If the bonding area between the light-transmissive member and substrate is increased, then the bonding strength is improved, but the light extraction efficiency is reduced due to reduced exposed lateral wall portion area
Solution Approach 1:
The patent implements local quality by configuring different sides of the substrate with different surface characteristics. The fourth side (opposite the light-exiting surface) is designed with specific surface features that optimize bonding without compromising light extraction. This allows the bonding areas to be strategically positioned and sized to maintain strength while preserving light extraction efficiency through the lateral wall portions.
Solution Approach 2:
The patent addresses the area trade-off by utilizing the vertical dimension and surface topology rather than simply increasing horizontal bonding area. The lateral wall portions extend vertically, providing bonding surface area in the third dimension while maintaining adequate light extraction paths. This dimensional approach allows both bonding strength and light extraction efficiency to be optimized simultaneously.
Data Source
AI summary
An upper surface of a lateral wall portion of a substrate includes a first upper surface portion exposed from a light-transmissive member in a first region, a second upper surface portion exposed from the light-transmissive member in a second region, and a third upper surface portion located between the first upper surface portion and the second upper surface portion in a second direction, and an upper surface of an outer peripheral portion of the light-transmissive member includes a first outer peripheral surface portion located in the first region. An area of the first upper surface portion of the lateral wall portion is greater than an area of the first outer peripheral surface portion of the outer peripheral portion of the light-transmissive member. A bonding member is disposed between the third upper surface portion of the lateral wall portion and the first lower surface portion of the light-transmissive member.