LED Packaging Substrate with Localized Reflective Layer
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Solution Overview
Problem
Existing LED packaging technologies face challenges in achieving high reflectivity and thermal conductivity while maintaining low costs, as they often require expensive highly reflective substrates to cover entire luminaire surfaces.
Innovation Solution
A low-cost LED packaging device that incorporates a highly reflective substrate with a reflectivity greater than 97%, featuring a thicker aluminum layer, insulating, and reflective layers, is disposed within a hole in a printed circuit board, allowing only small portions of the substrate to be used near the LED dies, thereby reducing material costs and maintaining effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If highly reflective aluminum substrate is used to cover entire luminaire surfaces, then reflectivity is improved, but cost increases excessively
Solution Approach 1:
The patent applies local quality by placing highly reflective aluminum substrate only in specific locations where LED dies are mounted, rather than covering the entire luminaire surface. This localized approach maintains high reflectivity where needed while significantly reducing material costs for areas where full coverage is unnecessary.
Solution Approach 2:
The patent segments the luminaire surface into multiple regions, with highly reflective aluminum substrate applied only to specific segments containing LED dies, while other areas use less expensive materials or no reflective coating. This segmentation allows optimization of reflectivity where it matters most while controlling overall cost.
2Illumination intensity
If highly reflective substrate is used, then reflectivity is improved, but material cost increases
Solution Approach 1:
The patent applies local quality by placing highly reflective aluminum substrate only in specific locations where LED dies are mounted, rather than covering the entire luminaire surface. This localized approach maintains high reflectivity where needed while significantly reducing material costs for areas where full coverage is unnecessary.
Solution Approach 2:
The patent uses partial action by applying reflective coating only to the extent necessary for optimal LED performance, rather than providing complete surface coverage. This partial application of reflective material achieves sufficient light reflection while minimizing material consumption and cost.
3Ease of manufacture
If LED dies are mounted directly to printed circuit board, then manufacturing cost is reduced, but heat dissipation and reflectivity are compromised
Solution Approach 1:
The patent uses composite materials by combining printed circuit board with highly reflective aluminum substrate layers. This composite structure provides both the cost benefits of PCB mounting and the thermal management and optical performance of reflective aluminum substrates, achieving a balance between manufacturing cost and functional performance.
Solution Approach 2:
The patent merges the functions of PCB mounting with reflective substrate properties by integrating aluminum substrate layers into the PCB structure. This combination allows the system to benefit from both the manufacturing advantages of direct PCB mounting and the thermal/optical advantages of highly reflective substrates.
4Productivity
If LED dies are mounted directly to printed circuit board, then manufacturing steps are reduced, but thermal conductivity is insufficient
Solution Approach 1:
The patent uses composite materials by combining printed circuit board with highly reflective aluminum substrate layers. This composite structure provides both the cost benefits of PCB mounting and the thermal management and optical performance of reflective aluminum substrates, achieving a balance between manufacturing cost and functional performance.
Solution Approach 2:
The patent applies multi-functionality by designing the PCB-integrated aluminum substrate structure to simultaneously provide electrical connection, mechanical support, thermal management, and optical reflection functions. This multi-functional approach eliminates the need for separate components while maintaining all necessary performance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides superior reflectivity and thermal conductivity without the need for expensive substrates, reducing manufacturing costs and enhancing the operational efficiency and lifespan of LED luminaire devices.
Implementation Method 1
a thicker aluminum layer, insulating, and reflective layers
Implementation Method 2
The highly reflective substrate has a reflectivity greater than 97%
Data Source
AI summary
A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.