Strip LED Substrate with Openings for Heat Dissipation
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Solution Overview
Problem
Existing LED packaging substrates face issues with uniform light emission, inability to emit light at multiple angles, and poor heat dissipation, leading to inefficiencies in light emission and bulb longevity.
Innovation Solution
A substrate designed with a strip shape, featuring spiral wires and openings along its length and width, allowing for omnidirectional light transmission and enhanced heat dissipation through air ventilation, with LED chips connected in series and parallel configurations for diverse lighting control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a transparent substrate is used to achieve 360-degree light transmission, then light emission omnidirectionality is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The substrate is divided into multiple segments with openings between them, creating a segmented structure that allows both light transmission and heat dissipation. The openings act as channels for air flow while the substrate segments maintain light transmission capability.
Solution Approach 2:
The substrate incorporates a porous or open structure with openings that facilitate air circulation. This porous design allows heat to escape through convection while still permitting light to pass through the substrate material.
2Temperature
If an opaque substrate is used to improve heat dissipation, then heat dissipation performance is improved, but light emission omnidirectionality deteriorates
Solution Approach 1:
The substrate is segmented with openings that create pathways for heat dissipation. The segmentation allows the substrate to maintain structural integrity and heat dissipation capability while enabling light transmission through the openings and substrate edges.
Solution Approach 2:
The design transitions from a two-dimensional planar substrate to a three-dimensional structure with openings and varying thickness. This dimensional change allows simultaneous optimization of heat dissipation (through vertical air flow channels) and light emission (through edge and opening illumination).
3Ease of manufacture
If a planar rectangular substrate is used to simplify manufacturing, then ease of manufacture is improved, but light emission uniformity deteriorates
Solution Approach 1:
The substrate incorporates curved or non-linear geometric features such as circular openings and rounded edges. These curved elements help distribute light more uniformly by reducing sharp edges that cause light concentration, while still being manufacturable using standard fabrication techniques.
4Device complexity
If LED chips are arranged in a single plane to simplify structure, then device complexity is reduced, but light emission angle and multi-level luminescence deteriorate
Solution Approach 1:
The LED chip arrangement extends from a two-dimensional planar configuration to a three-dimensional multi-level structure. LED chips are positioned at different heights and depths, creating multi-level luminescence that increases the effective light emission angle and provides more uniform light distribution in space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate enables omnidirectional light emission, improved heat dissipation, and longer bulb life by allowing LED chips to be arranged in various colors and brightness levels, forming an intelligent lighting system with enhanced control and ventilation.
Implementation Method 1
improved heat dissipation through air ventilation
Data Source
AI summary
The invention provides a substrate for LED packaging, a LED package and a LED bulb. The substrate is in a strip shape, at least one end of the substrate is provided with an electrode lead-out wire. The electrode lead-out wire is connected to the substrate by a connecting component and/or a connecting material, wherein at least one opening arranged along the length direction of the substrate is provided on the substrate. The LED package comprises the substrate, the substrate is provided with a plurality of LED chips, and the plurality of LED chips are connected in series and/or parallel with each other by connecting wires. The LED bulb of the present invention has the LED package. According to the invention, the openings in the middle part of the substrate make the arrangement and control of the LED chips on the substrate simpler and more diversified, which facilitates the air ventilation and heat dissipation of the LED package, makes the service life of the LED bulb longer, and makes the emitting angle more all-directional.