Configurable LED Substrate with Rotatable Multi-LED Over-Optic
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Solution Overview
Problem
LED fixtures require application-specific printed circuit boards (PCBs) with pre-positioned LEDs, leading to high manufacturing costs and variability in light output due to the need for multiple PCB sizes and layouts, as well as difficulties in adjusting light direction without replacing optics, which is time-consuming and costly.
Innovation Solution
A configurable LED substrate with etched electrical traces and multiple coupling points that can accommodate varying numbers and layouts of LEDs, combined with a multi-LED over-optic that can be rotated in 90-degree increments to adjust light direction, allowing for a single PCB form factor to meet different application requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If application-specific PCBs with pre-positioned LEDs are used, then the desired light output and power usage requirements are met, but the manufacturing cost increases and the number of PCB sizes and layouts must be kept in stock
Solution Approach 1:
The patent applies universality by designing a single standardized PCB platform that can accommodate multiple LED configurations through adjustable mounting positions and modular LED modules. This allows one PCB design to serve multiple lighting applications by repositioning LEDs or LED modules rather than requiring separate application-specific PCBs for each lighting scenario.
Solution Approach 2:
The patent implements dynamics through adjustable and reconfigurable LED mounting mechanisms on the PCB, allowing the LED positions to be changed after manufacturing. This enables the same PCB to adapt to different light output requirements by dynamically repositioning LEDs or LED modules, eliminating the need for multiple static PCB designs.
2Manufacturing precision
If over-optics are individually coupled or positioned over each discrete LED, then light distribution is optimized, but adjusting light direction requires individually repositioning each over-optic which is time consuming and expensive
Solution Approach 1:
The patent merges multiple individual over-optics into a single integrated multi-LED over-optic assembly that covers multiple LEDs simultaneously. This consolidation allows the entire optical system to be adjusted as one unit rather than requiring individual repositioning of each over-optic, significantly reducing adjustment time while maintaining optimized light distribution.
Solution Approach 2:
The patent implements dynamics by designing the multi-LED over-optic assembly with adjustable mounting mechanisms that allow the entire optical assembly to be repositioned collectively. This enables dynamic adjustment of light direction for multiple LEDs simultaneously, rather than requiring static individual positioning that would need to be repeated for each LED.
3Adaptability or versatility
If multiple PCB sizes and layouts are kept in stock to meet varying requirements, then different lighting applications can be satisfied, but inventory complexity and manufacturing cost increase
Solution Approach 1:
The patent applies universality by creating a standardized PCB platform with universal mounting features and trace patterns that can support multiple LED configurations. This single universal PCB design replaces the need for multiple application-specific PCB variants, allowing the same hardware platform to serve different lighting applications through software or physical reconfiguration.
Solution Approach 2:
The patent segments the LED lighting system into modular components where LEDs can be arranged in different configurations on the same PCB. By segmenting the lighting function into independent LED modules that can be positioned at various locations on the universal PCB, the system achieves versatility without requiring multiple complete PCB designs.
Data Source
AI summary
A light emitting diode (LED) module having a configurable LED substrate capable of receiving varying numbers and layouts of LEDs are described herein. The LED substrate includes LED coupling points for receiving the LEDs and electrical traces etched into the substrate for routing power to the LEDs. The LED module can include a multi-LED over-optic having multiple over-optics that are configured to match the number and configuration of the LEDs positioned on the substrate. The LED coupling points and over-optics can be arranged symmetrically to enable the LED module to be rotated to adjust the light output distribution and direction. The LED module can include a power connection mechanism, for example located at the center of the substrate, that also allows the LED module to be rotated. One or more of the LED modules may be mounted on a heat sink and incorporated into a light fixture.