Peelable Bonding Layer for LED Substrate Rework
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Solution Overview
Problem
The existing LED light-source substrates face difficulties in reworking the reflective layer when mistakes occur during its formation, as physically scraping or washing the layer off the mold resin can damage the substrate and is not practical for restoration.
Innovation Solution
The proposed LED light-source substrate includes a flip-chip type LED mounted on a substrate with a first bonding sheet and a second bonding sheet, where the second bonding sheet is designed to be peelable from the first, allowing for easy removal and reformation of the reflective layer, with a weaker adhesive strength and specific material properties to facilitate this process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the reflective layer is formed directly on the mold resin surface, then the manufacturing process is simple, but the reflective layer cannot be easily removed for rework
Solution Approach 1:
The patent divides the bonding structure into multiple separable layers: a first bonding sheet directly on the substrate, and a second bonding sheet on top of the first. The reflective layer is formed on the second bonding sheet, which can be peeled off separately from the first bonding sheet. This segmentation allows the reflective layer to be removed for rework without damaging the substrate or the first bonding sheet.
Solution Approach 2:
The second bonding sheet acts as an intermediary layer between the reflective layer and the first bonding sheet. This intermediary structure enables easy removal of the reflective layer by peeling off the second bonding sheet, while the first bonding sheet remains intact on the substrate. The intermediary layer solves the contradiction by providing a removable interface without complicating the overall manufacturing process.
2Ease of repair
If the reflective layer is physically scraped or washed off the mold resin, then the reflective layer can be removed, but the substrate is damaged
Solution Approach 1:
By segmenting the bonding structure into separable first and second bonding sheets, the patent enables removal of the reflective layer through peeling the second bonding sheet alone, avoiding the need to scrape or wash the substrate surface. This preserves substrate integrity while achieving reflective layer removal for rework.
Solution Approach 2:
The second bonding sheet serves as a mediator that can be easily peeled off with the reflective layer, preventing direct contact between removal forces and the substrate. This intermediary structure eliminates the need for damaging scraping or washing operations while maintaining substrate reliability.
3Strength
If a strong adhesive is used to bond the bonding sheets, then the bonding is secure, but the reflective layer cannot be peeled off for rework
Solution Approach 1:
The patent applies different adhesive strengths to different bonding interfaces: the first bonding sheet uses strong adhesive to ensure secure bonding to the substrate, while the second bonding sheet uses weak adhesive to enable easy peeling for rework. This local differentiation of adhesive quality resolves the contradiction between secure bonding and easy removal.
Solution Approach 2:
The patent changes the adhesive strength parameter at different bonding interfaces. The first bonding interface (substrate to first bonding sheet) has high adhesive strength, while the second bonding interface (first bonding sheet to second bonding sheet) has low adhesive strength. This parameter variation enables both secure overall bonding and easy peeling of the second bonding sheet for reflective layer rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient reworking of the reflective layer without damaging the substrate, allowing for cost-effective restoration of the LED light-source substrate when mistakes occur during its formation.
Implementation Method 1
a first bonding sheet having transmissivity and formed on the substrate and moreover covering the LED, a second bonding sheet having transmissivity and formed on the first bonding sheet... The second bonding sheet is bonded peelably from the first bonding sheet
Data Source
AI summary
An LED light-source substrate includes a first bonding sheet covering the LED, a second bonding sheet formed on the first bonding sheet, and a reflective layer formed on the second bonding sheet to suppress light from the LED. The second bonding sheet is bonded peelably from the first bonding sheet.