Light-Transmissive Substrate with Reflective Side Coating for LED Heat Management
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Solution Overview
Problem
Existing light-emitting devices face challenges in efficiently extracting light while preventing heat-related issues and maintaining structural integrity, particularly in small form factors where heat from the light-emitting elements can cause deterioration or deformation.
Innovation Solution
A light-emitting device design featuring a base with a light-emitting element, a wavelength conversion member, and a light reflecting member, where the light reflecting member covers the side surface of the light transmissive substrate to enhance light extraction efficiency and manage heat through a base material with a low coefficient of linear expansion and high thermal emissivity, combined with a wavelength conversion member in a recess on the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light-emitting element is used to emit blue light with a phosphor material to convert wavelength, then white light is emitted, but heat is generated that can cause deterioration or deformation in small form factors
Solution Approach 1:
The patent applies this principle by using the light reflecting member to convert harmful light leakage into beneficial light extraction. The reflecting member captures light that would otherwise be wasted or cause heat issues and redirects it toward the light extraction surface, thereby improving overall light efficiency and reducing heat generation in compact devices
2Loss of energy
If the side surface of the light transmissive substrate is left uncovered, then light can escape, but light leakage occurs and reduces efficiency
Solution Approach 1:
The patent applies this principle by extracting the light management function from the substrate itself and implementing it through a separate light reflecting member. This modular approach allows the substrate to focus on light transmission while the dedicated reflecting member handles light redirection, preventing light leakage and improving extraction efficiency
3Volume of moving object
If the device is made compact to reduce size, then portability is improved, but heat management becomes more difficult and structural integrity is compromised
Solution Approach 1:
The patent applies this principle by using a light transmissive substrate with specific material properties that combine optical transparency with mechanical strength. The substrate is designed to be both light-permeable and sufficiently rigid to maintain structural integrity in compact devices, while the light reflecting member adds another layer of functional material to manage light and heat in the reduced form factor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents light leakage, enhances light extraction efficiency, and improves heat management, leading to a more stable and efficient light-emitting device with extended lifespan.
Implementation Method 1
a phosphor material excited by partially absorbing the blue light and emitting a light having a longer wavelength, so that a white light is emitted
Implementation Method 2
a light reflecting member provided to cover the substrate side surface
Data Source
AI summary
A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.