Light-emitting Substrate Repair via Vertical Sub-conductive Lines

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing techniques for transferring light-emitting diodes (LEDs) onto a drive substrate often result in transfer errors and defects, leading to operational issues in display devices, which necessitate reserved spaces for additional LEDs, limiting display resolution and pixel size.

Innovation Solution

A light-emitting substrate design that includes a substrate with conductive lines, insulating layers, and sub-conductive lines, allowing for the overlap of these lines perpendicular to the substrate, enabling efficient repair of faulty LEDs by replacing them with additional devices, thereby reducing the need for reserved space and improving resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If space is reserved in pixels for additional light-emitting diodes to compensate for transfer errors and defects, then the reliability of the display device is improved, but the pixel size cannot be reduced which limits the resolution of the display device

Engineering Contradiction:
Improvedisplay device operation reliabilityVSAvoiddisplay resolution
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a sub-conductive line disposed on an insulating layer that overlaps with the first and second conductive lines in a direction perpendicular to the substrate. This three-dimensional arrangement allows the sub-conductive line to carry repair signals without occupying additional planar space within the pixel, thereby maintaining high display resolution while enabling reliable defect compensation through additional light-emitting diodes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The sub-conductive line is nested within the existing pixel structure by placing it on the insulating layer that already covers the first and second conductive lines. This nested configuration allows the repair circuitry to be integrated within the existing pixel footprint without requiring additional reserved space, thus improving reliability while maintaining resolution.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of repair

If reserved spaces are allocated for repair circuits and additional light-emitting diodes, then the ease of repair is improved, but the area occupied by each pixel increases

Engineering Contradiction:
Improvelight-emitting diode defect repair capabilityVSAvoidpixel area
Core Design Contradiction:
Ease of repairVSArea of stationary object

Solution Approach 1:

By transitioning from a two-dimensional planar arrangement to a three-dimensional stacked configuration with the sub-conductive line on the insulating layer, the patent enables repair functionality without increasing the pixel's planar area. The vertical stacking allows repair circuits to coexist with display elements within the same footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The sub-conductive line is merged with the existing conductive line structure by overlapping them in the vertical direction. This merging allows the repair circuit to share the same spatial envelope as the display circuit, eliminating the need for separate reserved spaces and reducing overall pixel area.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11171124B2Light-emitting substrate and repair method thereof
Publication Date: 2021.11.09 AU OPTRONICS CORP
  • US11171124B2 patent drawing
  • US11171124B2 patent drawing
  • US11171124B2 patent drawing

AI summary

A light-emitting substrate and a repair method thereof are provided. The light-emitting substrate includes a substrate, a first conductive line, a second conductive line, a signal line, an insulating layer, first to third light-emitting devices, and a first sub-conductive line. The first and second conductive lines and the signal line are disposed on the substrate. The insulating layer is disposed on the first and second conductive lines. The first to third light-emitting devices are disposed on the substrate. The first light-emitting device is disposed corresponding to the first conductive line. The second light-emitting device is disposed corresponding to the second conductive line. The first to third light-emitting devices are disposed corresponding to the signal line. The first sub-conductive line is disposed on the insulating layer. The first sub-conductive line is overlapped with the first and second conductive lines. The third light-emitting device is disposed corresponding to the first sub-conductive line.